HF-Free, Lead-Free Compatible FR-4

SHENGYI TECHNOLOGY — HF-FREE, Lead-Free Compatible FR-4 PRODucts

S1150G
HALOGEN FREE & MID-Tg

S1150G

wdt_IDPROPERTY TYPEPROPERTYTypical ValueUnitsConditionTest Method
1 Thermal Glass Transition Temperature, Tg 160 °C A DMA IPC-TM-650 2.4.24.2
2 Thermal Glass Transition Temperature, Tg 155 °C A DSC IPC-TM650 2.4.25
3 Thermal Thermal Expansion, Z CTE 40 ppm/°C A Before Tg, IPC-TM-650 2.4.24
4 Thermal Thermal Expansion, Z CTE 230 ppm/°C A After Tg, IPC-TM-650 2.4.24
5 Thermal Decomposition Temperature, Td 355 °C A TMA IPC-TM650 2.4.24.6
6 Thermal Delamination Time, T260 60 minutes A TMA IPC-TM650 2.4.24
7 Thermal Delamination Time, T288 45 minutes A TMA IPC-TM650 2.4.24
8 Electrical Dielectric Constant (Dk) 4.6 - 1 GHz IPC-TM-650 2.5.5.9
9 Electrical Dielectric Constant (Dk) 4.9 - 1 MHz IPC-TM-650 2.5.5.9
10 Electrical Dissipation Factor (Df) 0.011 - 1 GHz IPC-TM-650 2.5.5.9


PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email: Fredhickman@syst.com.cn
Phone: 602-722-4053

Click on the link to download the file

Technical Datasheet:  S1150G-DS.pdf

Material Safety Datasheet: 

S11501
HALOGEN FREE & CTI MATERIAL

S1151GB

wdt_IDTEST ITEMSTREATMENT CONDITIONUNITSPECTYPICAL VALUE
1 Tg DSC °C ≥140 150
2 Flammability C-48/23/50,E-24/125 Rating UL94 V-0 UL94 V-0
3 Flammability E-24/125+des Rating UL94 V-0 UL94 V-0
4 Volume Resistivity After moisture resistance MΩ-cm ≥106 6.4×107
5 Volume Resistivity E-24/125 MΩ-cm ≥103 5.3×106
6 Surface Resistivity After moisture resistance ≥104 4.8×107
7 Surface Resistivity E-24/125 ≥103 2.8×106
8 Arc Resistance D-48/50+D-0.5/23 S ≥60 140
9 Dielectric Breakdown D-48/50+D-0.5/23 KV ≥40 45+KV NB
10 Dielectric Constant (1MHz) C-24/23/50 - ≤5.4 5.1


PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email: Fredhickman@syst.com.cn
Phone: 602-722-4053

Click on the link to download the file

Technical Datasheet:  S1151G-DS.pdf

Material Safety Datasheet: 

S1165/ S1165M
HIGH PERFORMANCE HALOGEN FREE

S1165G

wdt_IDTEST ITEMSTREATMENT CONDITIONUNITSPECTYPICAL VALUE
1 Tg DSC °C ≥170 175
2 Tg DMA °C - 195
3 Flammability C-48/23/50,E-24/125 Rating V-0 V-0
4 Flammability E-24/125+des Rating V-0 V-0
5 Volume Resistivity After moisture resistance MΩ-cm ≥106 4.76×108
6 Volume Resistivity E-24/125 MΩ-cm ≥103 5×106
7 Surface Resistivity After moisture resistance ≥104 1.84×107
8 Surface Resistivity E-24/125 ≥103 5.00×106
9 Arc Resistance D-48/50+D-0.5/23 S ≥60 181
10 Dielectric Breakdown D-48/50+D-0.5/23 KV ≥40 45+KV NB


PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email: Fredhickman@syst.com.cn
Phone: 602-722-4053

Click on the link to download the file

Technical Datasheet:  S1165S1165M-DS.pdf

Material Safety Datasheet: 

S1170
HIGH Tg HALOGEN FREE MATERIAL

S1170G

wdt_IDTEST ITEMSTREATMENT CONDITIONUNITSPECTYPICAL VALUE
1 Tg DMA °C ≥170 180
2 Flammability C-48/23/50,E-24/125 Rating V-0 V-0
3 Flammability E-24/125+des Rating V-0 V-0
4 Volume Resistivity After moisture resistance MΩ-cm ≥106 5.65×107
5 Volume Resistivity E-24/125 MΩ-cm ≥103 2.71×107
6 Surface Resistivity After moisture resistance ≥104 5.99×106
7 Surface Resistivity E-24/125 ≥103 4.44×106
8 Arc Resistance D-48/50+D-0.5/23 S ≥60 180
9 Dielectric Breakdown D-48/50+D-0.5/23 KV ≥40 45+KV NB
10 Dielectric Constant 52% IPC-TM-650 2.5.5.9(1GHz) - ≤5.4 4.4


PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email: Fredhickman@syst.com.cn
Phone: 602-722-4053

Click on the link to download the file

Technical Datasheet:  S1170G-DS.pdf

Material Safety Datasheet: 

S7040G
HALOGEN FREE & MID LOSS MATERIAL

• Server, Switch, Routers and Base station

• Backplane, Line cards

• High Tg>170℃(DSC);

• Lower insertion loss, Dk/Df@1GHz: 3.9/0.0075;

• Lower Z-axis CTE, offering superior PTH Reliability;

• Excellent Anti-CAF Performance;

• Halogen free and compatible with lead free process.

S7040GB

wdt_IDTEST ITEMSTREATMENT CONDITIONUNITSPECTYPICAL VALUE
1 Tg DMA ˚C - 185
2 Tg DSC ˚C - 175
3 Flammability C-48/23/50,E-24/125 Rating V-0 V-0
4 Flammability E-24/125+des Rating V-0
5 Volume Resistivity After moisture resistance MΩ-cm ≥106 3.50×107
6 Volume Resistivity E-24/125 MΩ-cm ≥103 8.70×107
7 Surface Resistivity After moisture resistance ≥104 1.50×107
8 Surface Resistivity E-24/125 ≥103 6.70×107
9 Dielectric Breakdown D-48/50+D-0.5/23 KV ≥40 45+KV NB
10 Dielectric Constant RC 55% IPC-TM-650 2.5.5.9(1GHz) - ≤5.4 3.9


PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email: Fredhickman@syst.com.cn
Phone: 602-722-4053

Click on the link to download the file

Technical Datasheet:  S7040G DS

S7045G
HALOGEN FREE & HIGH-Tg MATERIAL FOR SERVERS

• Servers, Telecom, Base station Backplane, Line cards

• High performance computing Office Routers and etc.

• Lead-free compatible.

• High Tg Halogen-free, Tg 180˚C (DMA)

• UV Blocking/AOI compatible.

• Lower Z-axis CTE.

S7045GB

wdt_IDTEST ITEMSTREATMENT CONDITIONUNITSPECTYPICAL VALUE
1 Tg DMA °C ≥170 180
2 Flammability C-48/23/50,E-24/125 Rating V-0 V-0
3 Flammability E-24/125+des Rating V-0 V-0
4 Volume Resistivity After moisture resistance MΩ-cm ≥106 5.65 X 107
5 Volume Resistivity E-24/125 MΩ-cm ≥103 2.71 X 107
6 Surface Resistivity After moisture resistance ≥104 5.99 X 106
7 Surface Resistivity E-24/125 ≥103 4.44 X 106
8 Arc Resistance D-48/50+D-0.5/23 S ≥60 180
9 Dielectric Breakdown D-48/50+D-0.5/23 KV ≥40 45+KV NB
10 Dielectric Constant RC 52% IPC-TM-650 2.5.5.9(1GHz) - ≤5.4 4.4


PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email: Fredhickman@syst.com.cn
Phone: 602-722-4053

Click on the link to download the file

Technical Datasheet:  S7045G DS

Material Safety Datasheet:  S7045G MSDS