High Speed Digital

SHENGYI TECHNOLOGY — HIGH SPEED DIGITAL PRODUCTS

SYNAMIC 6N
ULTRA HIGH SPEED & ULTRA LOW LOSS LAMINATES AND PREPREGS

Synamic 6N is a proprietary high performance 205℃(DSC) glass transition temperature (Tg) PPE system for multilayer Printed Wiring Board(PWB) engineered for feature rich high speed digital (HSD) applications that require maximum electrical performance (up to 50 Gbs+/channel). It also provides superior thermal and reliability performance.

Synamic 6N has a Dielectric Constant (Dk) and Dissipation Factor (Df) of 3.35 and 0.0026 at 10 GHz using the IPC 2.5.5.5 test method. The system also exhibits a stable Dk & Df over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +125 ºC). It is also compatible with high layer count applications that require multiple 2 oz. copper layers and that have 0.8mm pitch It also has demonstrated excellent CAF resistance down to 0.8mm pitch when tested using industry standard CAF TVs across multiple OEMs.

The Synamic 6N system is available in spread and standard low Dk glass. The same resin system is available using standard E-Glass under the name Synamic 6N. Both are supplied with a 2um Rz roughness VLP copper as the default offering.

• High Speed Servers (25 – 50 Gbs/channel)

• High Speed SANs (25 – 50 Gbs/channel)

• Switches & Routers (25 – 50 Gbs/channel)

• High Layer Count Backplanes

• High Layer Count Line Cards

• Multiple 2 oz. Copper Layers

• 0.8mm Pitch

• Burn-in Boards

• HDI Builds

• Hybrid Builds

• Military & Aerospace

• Excellent Electrical Performance

• 3.35 Dk & 0.0026 Df @ 10 GHz (IPC 2.5.5.5)

• Stable Dk/Df over Frequency and Temperature

• Excellent Thermal Performance

• High Tg: 210 deg C

• Low CTE @ 45/180 ppm/°C

• High Td: 405°C (TGA @ 5% wt loss)

• Superior CAF Performance

• Excellent Performance in Hybrid and HDI Designs

• UL 94 V-0 Flame Rating

• Standard FR-4 PCB processes

Synamic 6N

wdt_IDPOPERTY TYPEPROPERTYTypical ValueUnitConditionTest Method
1 Thermal Glass Transition Temperature, Tg 210 A DMA IPC-TM-650 2.4.24.2
2 Thermal Glass Transition Temperature, Tg 205 A DSC IPC-TM-650 2.4.25
3 Thermal Thermal Expansion, Z CTE 45 A Before Tg, IPC-TM-650 2.4.24
4 Thermal Thermal Expansion, Z CTE 180 A After Tg, IPC-TM-650 2.4.24
5 Thermal Decomposition Temperature, Td 405 A TMA IPC-TM650 2.4.24.6
6 Thermal Delamination Time, T288 >120 minutes A TMA IPC-TM650 2.4.24
7 Thermal Delamination Time, T300 >60 minutes A TMA IPC-TM650 2.4.24
8 Thermal Humidity Resistance >10 cycles -
9 Electrical Dielectric Constant (Dk) 3.31 - 1 GHz IPC-TM-650 2.5.5.9
10 Electrical Dielectric Constant (Dk) 3.35 - 10 GHz IPC-TM-650 2.5.5.5


Standard Offerings

Standard Panel Sizes

Thickness – 0.002”(0.05mm) to 0.060” (1.5mm)

Copper – VLP with 2um Rz

Low Dk Glass – Spread & Standard

18” x 24” & 21”x24”

Additional panel sizes may be available upon request For most application the standard EDC foil should be used. When PIM and insertion loss is critic the RTF low profile copper foil should be considered.

PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email: Fredhickman@syst.com.cn
Phone: 602-722-4053

BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

 

SYNAMIC 6
ULTRA HIGH SPEED & ULTRA LOW LOSS LAMINATES AND PREPREGS

Synamic 6 is a proprietary high performance 210°C (DSC) glass transition temperature (Tg) PPE system for multilayer Printed Wiring Board(PWB) engineered for high speed digital (HSD) applications that require superior electrical performance (25 Gbs+/channel). It also provides superior thermal and reliability performance.

Synamic 6  has a Dielectric Constant (Dk) and Dissipation Factor (Df) of 3.50 and 0.0046 at 10 GHz using the IPC 2.5.5.5 test method. The system also exhibits a stable Dk & Df over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +125 ºC). It is also compatible with high layer count applications that require multiple 2 oz. copper layers and that have 0.8mm pitch  It also has demonstrated excellent CAF resistance down to 0.8mm pitch when tested using industry standard CAF TVs across multiple OEMs.

The Synamic 6 system is available in spread and standard E-Glass. The same resin system is available using low Dk glass under the name Synamic 6N. Both are supplied with a 2um Rz roughness VLP copper as the default offering.

• High Speed Servers (25 Gbs+/channel)

• High Speed SANs (25 Gbs+/channel)

• Switches & Routers (25 GBs+/channel)

• High Layer Count Backplanes

• High Layer Count Line Cards

• Multiple 2 oz. Copper Layers

• 0.8mm Pitch

• Burn-in Boards

• HDI Builds

• Hybrid Builds

• Military & Aerospace

• Excellent Electrical Performance

• 3.5 Dk & 0.0046 Df @ 10 GHz (IPC 2.5.5.5)

• Stable Dk/Df over Frequency and Temperature

• Excellent  Thermal Performance

• High Tg: 210°C (DSC)

• Low CTE @ 45/180 ppm/°C

• High Td: 405°C (TGA @ 5% wt loss)

• Superior CAF Performance

• Excellent Performance in Hybrid and HDI Designs

• UL 94 V-0 Flame Rating

• Standard FR-4 PCB processes

Synamic 6

wdt_IDPOPERTY TYPEPROPERTYTypical ValueUnitConditionTest Method
1 Thermal Glass Transition Temperature, Tg 210 A DMA IPC-TM-650 2.4.24.2
2 Thermal Glass Transition Temperature, Tg 210 A DSC IPC-TM-650 2.4.25
3 Thermal Thermal Expansion, Z CTE 45 A Before Tg, IPC-TM-650 2.4.24
4 Thermal Thermal Expansion, Z CTE 180 A After Tg, IPC-TM-650 2.4.24
5 Thermal Decomposition Temperature, Td 405 A TMA IPC-TM650 2.4.24.6
6 Thermal Delamination Time, T288 >120 minutes A TMA IPC-TM650 2.4.24
7 Thermal Delamination Time, T300 >60 minutes A TMA IPC-TM650 2.4.24
8 Thermal Humidity Resistance >10 cycles -
9 Electrical Dielectric Constant (Dk) 3.64 - 1 GHz IPC-TM-650 2.5.5.9
10 Electrical Dielectric Constant (Dk) 3.5 - 10 GHz IPC-TM-650 2.5.5.5


Standard Offerings

Standard Panel Sizes

Thickness – 0.002”(0.05mm)to 0.060” (1.5mm)

Copper – VLP with 2um Rz

E-Glass – Spread & Standard

18” x 24” & 21”x24”

Additional sizes may be available upon request For most application the standard EDC foil should be used. When PIM and  insertion loss is critic the RTF low profile copper foil should be considered.

PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email: Fredhickman@syst.com.cn
Phone: 602-722-4053

BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

S7439
HIGH SPEED & LOW LOSS LAMINATES AND PREPREGS

S7439 is a proprietary high performance 200℃(DSC) glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) engineered for applications that require excellent electrical, thermal and reliability performance.

S7439  has a Dielectric Constant (Dk) and Dissipation Factor (Df) of 3.80 and 0.0068 at 10 GHz using the IPC 2.5.5.5 test method. The system also exhibits a stable Dk & Df over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +125 ºC). It is also compatible with high layer count applications that require multiple 2 oz. copper layers and that have 0.8mm pitch.  It also has demonstrated excellent CAF resistance down to 0.7mm pitch when tested using industry standard CAF TVs across multiple OEMs.

The S7439 system is available in spread and standard E-Glass. It is supplied with a 3um Rz roughness VLP copper as the default offering. A 2um VLP copper is also available if additional electrical bandwidth is needed.

• High Speed Servers

• High Speed SANs

• Switches & Routers

• High Layer Count Backplanes

• High Layer Count Line Cards

• Multiple 2 oz. Copper Layers

• 0.8mm Pitch

• Burn-in Boards

• HDI Builds

• Hybrid Builds

• Military & Aerospace

• Excellent  Thermal Performance

• High Tg: 200℃ (DSC)

• Low CTE @ 45/210 ppm/°C

• High Td: 385°C (TGA @ 5% wt loss)

• Excellent Electrical Performance

• 3.8 Dk & 0.0068 Df @ 10 GHz (IPC 2.5.5.5)

• Stable Dk/Df over Frequency and Temperature

• Superior CAF Performance

• Excellent Performance in Hybrid and HDI Designs

• UL 94 V-0 Flame Rating

• Standard FR-4 PCB processes

S7439

wdt_IDPOPERTY TYPEPROPERTYTypical ValueUNITConditionTest Method
1 Thermal Glass Transition Temperature, Tg 205 A DMA IPC-TM-650 2.4.24.2
2 Thermal Glass Transition Temperature, Tg 200 A DSC IPC-TM-650 2.4.25
3 Thermal Thermal Expansion, Z CTE 45 A Before Tg, IPC-TM-650 2.4.24
4 Thermal Thermal Expansion, Z CTE 210 A After Tg, IPC-TM-650 2.4.24
5 Thermal Decomposition Temperature, Td 385 A TMA IPC-TM650 2.4.24.6
6 Thermal Delamination Time, T288 120 minutes A TMA IPC-TM650 2.4.24
7 Thermal Delamination Time, T300 60 minutes A TMA IPC-TM650 2.4.24
8 Thermal Humidity Resistance >10 cycles -
9 Electrical Dielectric Constant (Dk) 3.85 - 1 GHz IPC-TM-650 2.5.5.9
10 Electrical Dielectric Constant (Dk) 3.8 - 10 GHz IPC-TM-650 2.5.5.5


Standard Offerings

Standard Panel Sizes

Thickness – 0.002”(0.05mm) to 0.060” (1.5mm)

Copper – VLP with 3um Rz

E-Glass – Spread & Standard

18” x 24”, 21”x24” & 27” x 24”

Additional panel sizes may be available upon request For most application the standard EDC foil should be used. When PIM and insertion loss is critic the RTF low profile copper foil should be considered.

PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email: Fredhickman@syst.com.cn
Phone: 602-722-4053

BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

SE65G
MID-LOSS HIGH Tg & HALOGEN FREE MATERIAL

• Mid-loss High Tg & Halogen Free Material

• High Tg 170℃(DSC),Td405℃ and T288 60mins;

• Low Dk/Df@10GHz: 4.08/0.0104;

• Lower Z-axis CTE, offering superior PTH Reliability;

• Excellent Anti-CAF Performance

• Higher heat resitance,Td(5% loss):405℃;

• Halogen free and compatible with lead free process

• Application for Server, Switch and Base station

SE65G

wdt_IDTEST ITEMSTREATMENT CONDITIONUNITSPECTYPICAL VALUE
1 Tg DMA °C - 185
2 Tg DSC °C - 175
3 Flammability C-48/23/50,E-24/125 Rating V-0 V-0
4 Flammability E-24/125+des Rating V-0 V-0
5 Volume Resistivity After moisture resistance MΩ-cm ≥106 3.50×107
6 Volume Resistivity E-24/125 MΩ-cm ≥103 8.70×107
7 Surface Resistivity After moisture resistance ≥104 1.50×107
8 Surface Resistivity E-24/125 ≥103 6.70×107
9 Dielectric Breakdown D-48/50+D-0.5/23 KV ≥40 45+KV NB
10 Dielectric Constant RC 55% IPC-TM-650 2.5.5.9(1GHz) - ≤5.4 3.90


PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email: Fredhickman@syst.com.cn
Phone: 602-722-4053

BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

Technical Datasheet:  SE65G-DS.pdf