Lead-Free Compatible FR-4

SHENGYI TECHNOLOGY — Lead-Free Compatible FR-4 PRODUCTS

• Servers

• Storage Area Networks (SANs)

• Switches & Routers

• High Layer Count PCBs

• Computers

• Medical

• Test

• Leadfree Compatible FR4 Laminates & Prepregs

• Tg: 180°C (DSC)

• High Heat Resistance

• Low Z-Axis CTE

• Excellent Through Hole Reliability

• Superior CAF Performance

• Low Water Absorption

• UL 94 V-0 Flame Rating

S1000-2

wdt_IDPOPERTY TYPEPROPERTYTypical ValueUNITConditionTest Method
1 Thermal Glass Transition Temperature, Tg 185 A DMA IPC-TM-650 2.4.24.2
2 Thermal Glass Transition Temperature, Tg 180 A DSC IPC-TM650 2.4.25
3 Thermal Thermal Expansion, Z CTE 45 A Before Tg, IPC-TM-650 2.4.41
4 Thermal Thermal Expansion, Z CTE 220 A After Tg, IPC-TM-650 2.4.41
5 Thermal Decomposition Temperature, Td 345 A TMA IPC-TM650 2.4.24.6
6 Thermal Delamination Time, T260 60 minutes A TMA IPC-TM650 2.4.24
7 Thermal Delamination Time, T288 20 minutes A TMA IPC-TM650 2.4.24
8 Thermal Delamination Time, T300 5 minutes A TMA IPC-TM650 2.4.24
9 Electrical Dielectric Constant (Dk) 4.8 - 1 MHz IPC-TM-650 2.5.5.9
10 Electrical Dissipation Factor (Df) 0.013 - 1 MHz IPC-TM-650 2.5.5.9


Thickness

Copper Foil

Standard Size

0.002”-0.125” (0.5mm to 3.2mm)

3/8 oz. – 3oz. (12um – 105um)

40” x 48” (1020mm x 1220mm)

0.002”-0.125” (0.5mm to 3.2mm)

3/8 oz. – 3oz. (12um – 105um)

42” x 48” (1070mm x 1220mm)

0.002”-0.125” (0.5mm to 3.2mm)

3/8 oz. – 3oz. (12um – 105um)

36” x 48” (915mm x 1220mm)

PRODUCT CONTACTS

BRYAN WONG

Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

Click on the link to download the file

Technical Datasheet: S1000-2-DS

Process Guidelines Datasheet:  S1000-2-Process Guidelines

Material Safety Datasheet:  S1000-2-MSDS

•High layer count PCBs

•Automotive Electronics

•Computing & Communications

•Military & Aerospace

 

•Lower Z-Axis CTE for improved through hole reliability

• Excellent Mechanical Processability and Thermal Resistance

• Leadfree Compatible & CAF Resistant

S1000-2M

wdt_IDPOPERTY TYPEPROPERTYTypical ValueUnitsConditionTest Method
1 Thermal Glass Transition Temperature, Tg 185 A DMA IPC-TM-650 2.4.24.2
2 Thermal Glass Transition Temperature, Tg 180 A DSC IPC-TM650 2.4.25
3 Thermal Thermal Expansion, Z CTE 41 A Before Tg, IPC-TM-650 2.4.41
4 Thermal Thermal Expansion, Z CTE 208 A After Tg, IPC-TM-650 2.4.41
5 Thermal Decomposition Temperature, Td 355 A TMA IPC-TM650 2.4.24.6
6 Thermal Delamination Time, T260 60 minutes A TMA IPC-TM650 2.4.24
7 Thermal Delamination Time, T288 30 minutes A TMA IPC-TM650 2.4.24
8 Thermal Delamination Time, T300 15 minutes A TMA IPC-TM650 2.4.24
9 Electrical Dielectric Constant (Dk) - SPDR at 56% RC 4.49 - 1 GHz IPC-TM-650 2.5.5.9
10 Electrical Dielectric Constant (Dk) - SPDR at 56% RC 4.9 - 1 MHz IPC-TM-650 2.5.5.9


Thickness

Copper Foil

Standard Size

0.002”-0.125” (0.5mm to 3.2mm)

3/8 oz. – 3oz. (12um – 105um)

40” x 48” (1020mm x 1220mm)

0.002”-0.125” (0.5mm to 3.2mm)

3/8 oz. – 3oz. (12um – 105um)

42” x 48” (1070mm x 1220mm)

0.002”-0.125” (0.5mm to 3.2mm)

3/8 oz. – 3oz. (12um – 105um)

36” x 48” (915mm x 1220mm)

 

PRODUCT CONTACTS

BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

Click on the link to download the file

Technical Datasheet: S1000-2M

Process Guidelines Datasheet:  S1000-2M-Process Guidelines

Material Safety Datasheet:  S1000-2M-MSDS

S1190

wdt_IDPOPERTY TYPETypical ValueUNITConditionTest Method
1 Thermal Glass Transition Temperature, Tg 200 °C 0000-00-00 DMA IPC-TM-650 2.4.24.2
2 Thermal Glass Transition Temperature, Tg 190 °C 0000-00-00 DSC IPC-TM650 2.4.25
3 Thermal Expansion, Z CTE 45 ppm/°C 0000-00-00 Before Tg, IPC-TM-650 2.4.41
4 Thermal Expansion, Z CTE 210 ppm/°C 0000-00-00 After Tg, IPC-TM-650 2.4.41
5 Thermal Decomposition Temperature, Td 350 °C 0000-00-00 TMA IPC-TM650 2.4.24.6
6 Thermal Delamination Time, T260 60 minutes 0000-00-00 TMA IPC-TM650 2.4.24.1
7 Thermal Delamination Time, T288 45 minutes 0000-00-00 TMA IPC-TM650 2.4.24.1
8 Electrical Dielectric Constant (Dk) 4.6 - 0000-00-00 IPC-TM-650 2.5.5.9
9 Electrical Dielectric Constant (Dk) 4.8 - 0000-00-00 IPC-TM-650 2.5.5.9
10 Electrical Dissipation Factor (Df) 0.015 - 0000-00-00 IPC-TM-650 2.5.5.9


PRODUCT CONTACTS

BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

Click on the link to download the file

Technical Datasheet:  S1190 DS

Process Guidelines Datasheet:  S1190 Process Guidelines

Material Safety Datasheet:  S1190 MSDS