AEROWAVE 300
HIGH FREQUENCY LOW LOSS MATERIALS

AeroWave 300 PPE woven glass-reinforced ceramic UL 94 V-0 circuit materials present a strong value proposition for today’s designer where cost, performance and manufacturability are paramount. AeroWave 300 materials can be fabricated using standard FR-4 printed circuitry fabrication processes. The AeroWave 300 materials well suited for use in Hybrid multi-layer printed circuit configurations and are compatible for use in lead free assembly processes.

AeroWave 300 materials exhibit excellent electrical and mechanical properties with a consistent and stable dielectric constant and dissipation factor over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +125 ºC).

AeroWave 300 low loss, (0.0031 @ 10 GHz values) controlled dielectric materials (+/- 0.05) are available in a broad range of nominal cores and pre-pregs. These products have been  developed to provide unique material solutions for base station antennas and base station power amplifiers and other current and emerging RF/Microwave design requirements.

AeroWave 300 RF/Microwave low loss, controlled dielectric materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption, and copper peel strength. Passive Inter-modulation (PIM) performance values exceeding -158 dBc are typical (RTF and VLP type copper foils).

• Cellular Base Station Antennas

• Power Amplifiers

• Antenna Feed Networks

• Telemetry

• DAS & CPE Antenna

• RF Passive Components

• Stable Dk/Df over Frequency and Temperature

• Low dielectric tolerance +/- 0.05

• Low Moisture Absorption

• Passive Inter-modulation -158 dBc

• Excellent Copper Peel Strength

• UL 94 V-0 Flame Rating

• Standard FR-4 PCB processes

AEROWAVE 300

wdt_IDPROPERTYTypical ValueDirectionUnitsConditionTest Method
1 Dielectric Constant, εr (Process specification) 3.00±0.05 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
2 Dielectric Constant, εr (Design specification) 3.04 Z 6 GHz/23℃ Differential Phase Length Method
3 Dissipation Factor tan, δ 0.0031 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
4 Thermal Coefficient of εr 50 Z ppm/℃ -40~+150℃ IPC-TM-650 2.5.5.5
5 Volume Resistivity 2.21×109 MΩ·cm COND A IPC-TM-650 2.5.17.1
6 Surface Resistivity 6.84X107 COND A IPC-TM-650 2.5.17.1
7 Electrical Strength 60 Z KV/mm 0.51mm (0.020”) IPC-TM-650 2.5.6.2
8 Coefficient of Thermal Expansion 13 X ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
9 Coefficient of Thermal Expansion 13 Y ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
10 Coefficient of Thermal Expansion 30 Z ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41


 

PRODUCT

Standard Thickness

Standard Panel Size

Copper Foil

AeroWave 300

0.008”(0.203mm)

0.012”(0.304mm)

0.020”(0.508mm)

0.030”(0.762mm)

0.032(”0.813mm)

0.040”(1.016mm)

0.060”(1.524mm)

36”×48”, 42”×48”,

Additional panel sizes may be available upon

request

For most application the standard EDC foil should be used. When PIM and insertion loss is critical, the RTF low profile copper foil should be considered.

PRODUCT CONTACTS

David Barrell
Senior Director, OEM Marketing
RF Products North America
Email: DavidBarrell@syst.com.cn
Phone: 626-327-2056

Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet: Shengyi-AEROWAVE300-DATA SHEET

AEROWAVE 338
HIGH FREQUENCY LOW LOSS MATERIALS

AeroWave 338 hydrocarbon woven glass-reinforced ceramic UL 94 V-0 circuit materials present a strong value proposition for today’s designer where cost, performance and manufacturability are paramount. AeroWave 338 materials can be fabricated using standard FR-4 printed circuitry fabrication processes. The AeroWave 338 materials are well suited for use in Hybrid multi-layer printed circuit configurations and are compatible for use in lead free assembly processes. 

AeroWave 338 materials exhibit excellent electrical and mechanical properties with a consistent and stable dielectric constant and dissipation factor over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +125 ºC).

AeroWave 338 low loss, (0.0035 @ 10 GHz values) controlled dielectric materials (+/- 0.05) are available in a broad range of nominal cores and pre-pregs. These products have been developed to provide unique material solutions for current and emerging RF/Microwave design requirements.

AeroWave 338 RF/Microwave low loss, controlled dielectric materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption, and copper peel strength. Passive Inter-modulation (PIM) performance values exceeding -158 dBc are typical (RTF and VLP type copper foils).

• Auto Radar

• Base Station Transceivers

• Power Amplifiers

• RFID

• Telemetry

• DAS & CPE Antenna

• LNB

• Stable Dk/Df over Frequency and Temperature

• Low dielectric tolerance +/- 0.05

• Low Moisture Absorption

• Passive Inter-modulation -158 dBc

• Excellent Copper Peel Strength

• UL 94 V-0 Flame Rating

• Standard FR-4 PCB processes

AEROWAVE 338

wdt_IDPROPERTYTypical ValueDirectionUnitsConditionTest Method
1 Dielectric Constant, εr (Process specification) 3.38±0.05 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
2 Dielectric Constant, εr (Design specification) 3.56 Z 6 GHz/23℃ Differential Phase Length Method
3 Dissipation Factor tan, δ 0.0035 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
4 Thermal Coefficient of εr 50 Z ppm/℃ -40~+150℃ IPC-TM-650 2.5.5.5
5 Volume Resistivity 1.6×109 MΩ·cm COND A IPC-TM-650 2.5.17.1
6 Surface Resistivity 1.1X106 COND A IPC-TM-650 2.5.17.1
7 Electrical Strength 55 Z KV/mm 0.51mm (0.020”) IPC-TM-650 2.5.6.2
8 Coefficient of Thermal Expansion 16 X ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
9 Coefficient of Thermal Expansion 17 Y ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
10 Coefficient of Thermal Expansion 46 Z ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41


 

PRODUCT

Standard Thickness

Standard Panel Size

AeroWave 338

0.004” (0.101mm)

0.008” (0.203mm)

0.012” (0.304mm)

0.020” (0.508mm)

0.032” (0.813mm)

0.060” (1.524mm)

36”×48”, 42”×48”,

Additional panel sizes may be available upon request For most application the standard EDC foil should be used. When PIM and insertion loss is critic the RTF low profile copper foil should be considered.

PRODUCT CONTACTS

David Barrell
Senior Director, OEM Marketing
RF Products North America
Email: DavidBarrell@syst.com.cn
Phone: 626-327-2056

Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet: Shengyi-AEROWAVE338-DATASHEET

AEROWAVE 350
HIGH FREQUENCY LOW LOSS MATERIALS

AeroWave 350 hydrocarbon woven glass-reinforced ceramic UL 94 V-0 circuit materials present a strong value proposition for today’s designer where cost, performance and manufacturability are paramount. AeroWave 350 materials can be fabricated using standard FR-4 printed circuitry fabrication processes.The AeroWave 350 materials are well suited for use in Hybrid multi-layer printed circuit configurations and are compatible for use in lead free assembly processes.

AeroWave 350 materials exhibits excellent electrical and mechanical properties with a consistent and stable dielectric constant and dissipation factor over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +125 ºC).

AeroWave 350 low loss, (0.0033 @ 10 GHz values) controlled dielectric materials (+/- 0.05) are available in a broad range of nominal cores and pre-pregs. These products have been developed to provide unique material solutions for current and emerging RF/Microwave design requirements.

AeroWave 350 RF/Microwave low loss, controlled dielectric materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption, and copper peel strength. Passive Inter-modulation (PIM) performance values exceeding -157 dBc are typical (RTF and VLP type copper foils).

• Auto Radar

• Base Station Transceivers

• Power Amplifiers

• RFID

• Telemetry

• DAS & CPE Antenna

• LNB

• Stable Dk/Df over Frequency and Temperature

• Low dielectric tolerance +/- 0.05

• Low Moisture Absorption

• Passive Inter-modulation -157 dBc

• Excellent Copper Peel Strength

• UL 94 V-0 Flame Rating

• Standard FR-4 PCB processes

AEROWAVE 350

wdt_IDPROPERTYTypical ValueDirectionUnitsConditionTest Method
1 Dielectric Constant, εr (Process specification) 3.00±0.05 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
2 Dielectric Constant, εr (Design specification) 3.064 Z 6GHz/23℃ Differential Phase Length Method
3 Dissipation Factor tan, δ 0.002 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
4 Thermal Coefficient of εr 60 Z ppm/℃ -40C to +150℃ IPC-TM-650 2.5.5.5
5 Volume Resistivity 2.0×107 MΩ·cm COND A IPC-TM-650 2.5.17.1
6 Surface Resistivity 2.0X107 COND A IPC-TM-650 2.5.17.1
7 Electrical Strength 85 Z KV/mm 0.51mm (0.020”) IPC-TM-650 2.5.6.2
8 Coefficient of Thermal Expansion 17 X ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
9 Coefficient of Thermal Expansion 19 Y ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
10 Coefficient of Thermal Expansion 50 Z ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41


 

PRODUCT

Standard Thickness

Standard Panel Size

Copper Foil

AeroWave 350

0.008”(0.203mm)

0.012”(0.304mm)

0.020”(0.508mm)

0.030”(0.762mm)

0.032(”0.813mm)

0.040”(1.016mm)

0.060”(1.524mm)

36”×48”, 42”×48”,

Additional panel sizes may be available upon

request

For most application the standard EDC foil should be used. When PIM and insertion loss is critical, the RTF low profile copper foil should be considered.

PRODUCT CONTACTS

David Barrell
Senior Director, OEM Marketing
RF Products North America
Email: DavidBarrell@syst.com.cn
Phone: 626-327-2056

Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet: Shengyi-AEROWAVE350-DATASHEET

mmWAVE
ULTRA LOW LOSS WOVEN GLASS PPE MATERIAL

mmWave is designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms that extend into the millimeter range. mmWave is a PPE Woven Glass Controlled Dielectric Material with excellent electrical and mechanical properties with a consistent and stable dielectric constant and dissipation factor over a wide range of frequencies and temperatures. mmWave exhibits excellent dimensional stability, chemical resistance and low moisture absorption.

• Automotive Radar

• Base Station Antenna

• GPS Systems

• Point to Point Antenna

• Telemetry

• Avionics & Aerospace

• DAS & CPE Antenna

• mmWave Applications

• Low CTE

• Stable Dk over Frequency and Temperature

• Ultra Low Loss

• Low Moisture Absorption

• Passive Inter-modulation -158 dBc

• Excellent Copper Peel Strength

• UL 94 V-0 Flame Rating

mmWAVE

wdt_IDPROPERTYTypical ValueDirectionUnitsConditionTest Method
1 Dielectric Constant, εr (Process specification) 3.00±0.05 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
2 Dielectric Constant, εr (Design specification) 3.064 Z 6GHz/23℃ Differential Phase Length Method
3 Dissipation Factor tan, δ 0.002 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
4 Thermal Coefficient of εr 60 Z ppm/℃ -40C to +150℃ IPC-TM-650 2.5.5.5
5 Volume Resistivity 2.0×107 MΩ·cm COND A IPC-TM-650 2.5.17.1
6 Surface Resistivity 2.0X107 COND A IPC-TM-650 2.5.17.1
7 Electrical Strength 85 Z KV/mm 0.51mm (0.020”) IPC-TM-650 2.5.6.2
8 Coefficient of Thermal Expansion 17 X ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
9 Coefficient of Thermal Expansion 19 Y ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
10 Coefficient of Thermal Expansion 50 Z ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41


 

PRODUCT

Standard Thickness

Standard Panel Size

Copper Foil

mmWave

0.005”(0.127mm)

0.010”(0.254mm)

 0.020”(0.508mm)

0.030”(0.762mm)

0.060”(1.524mm)

18”×12”(457*305mm)

18”×24”(457*610mm)

36”×48”(915*1220mm)

42”×48”(1067*1220mm)

½ oz. (18μm) HVLP copper foil.

1 oz. (35μm) HVLP copper foil.

2 oz. (70μm) RTF copper foil.

Other claddings may be available. Contact customer service.

PRODUCT CONTACTS

David Barrell
Senior Director, OEM Marketing
RF Products North America
Email: DavidBarrell@syst.com.cn
Phone: 626-327-2056

Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet: Shengyi-MM WAVE-DATA SHEET

S7136H
HIGH-FREQUENCY LOW LOSS MATERIALS

S7136H is a hydrocarbon woven glass-reinforced ceramic UL 94 V-0 circuit materials present a strong value proposition for today’s designer where cost, performance and manufacturability are paramount. S7136H materials can be fabricated using standard FR-4 printed circuitry fabrication processes.

The S7136H materials are well suited for use in Hybrid multi-layer printed circuit configurations and are compatible for use in lead free assembly processes.

S7136H materials exhibit excellent electrical and mechanical properties with a consistent and stable dielectric constant and dissipation factor over a wide range of frequencies (1GHz to 20 GHz) and temperatures (-40 ºC to +125 ºC).

S7136H low loss, (0.003 @ 10 GHz values) controlled dielectric materials (+/- 0.05) are available in a broad range of nominal cores and pre-pregs. These products have been developed to provide unique material solutions for current and emerging RF/Microwave design requirements.

S7136H RF/Microwave low loss, controlled dielectric materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption, and copper peel strength.

• Auto Radar

• Base Station Antennas

• Power Amplifiers

• RFID

• Telemetry

• DAS & CPE Antenna

• LNB

 

 • Stable Dk/Df over Frequency and Temperature

• Low dielectric tolerance +/- 0.05

• Low Moisture absorption

• Passive Intermodulation -158 dBc

• Excellent Copper Peel Strength

• UL 94 V-0 Flame Rating

S7136H

wdt_IDPROPERTYTypical ValueDirectionUnitsConditionTest Method
1 Dielectric Constant, εr (Process specification) 3.00±0.05 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
2 Dielectric Constant, εr (Design specification) 3.064 Z 6GHz/23℃ Differential Phase Length Method
3 Dissipation Factor tan, δ 0.002 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
4 Thermal Coefficient of εr 60 Z ppm/℃ -40C to +150℃ IPC-TM-650 2.5.5.5
5 Volume Resistivity 2.0×107 MΩ·cm COND A IPC-TM-650 2.5.17.1
6 Surface Resistivity 2.0X107 COND A IPC-TM-650 2.5.17.1
7 Electrical Strength 85 Z KV/mm 0.51mm (0.020”) IPC-TM-650 2.5.6.2
8 Coefficient of Thermal Expansion 17 X ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
9 Coefficient of Thermal Expansion 19 Y ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
10 Coefficient of Thermal Expansion 50 Z ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41


 

Standard Thickness Offerings

Standard Panel Sizes

Standard Copper Cladding

  0.010” (0.254mm)

0.020” (0.51mm)

0.030” (0.76mm)

0.060” (1.52mm)

36”X48”, 40” x 48” & 42”x48”

Additional panel sizes may be available

upon request.

1/2 oz. (17 um), 1 oz. (35  um)

electrodeposited copper foil

 

PRODUCT CONTACTS

David Barrell
Senior Director, OEM Marketing
RF Products North America
Email: DavidBarrell@syst.com.cn
Phone: 626-327-2056

Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

Click on the link to download the file

Technical Datasheet: Shengyi-S7136H-DS-rv1.-3-17

Process Guidelines Datasheet:  S7136H-Process Guidelines

Material Safety Datasheet:  S7136H MSDS

AEROBOND 350
PREPREG FOR HIGH FREQUENCY CIRCUITRY

AeroBond350 prepreg is an extension of S7136H core materials
and is suitable for use in multi-layer constructions with either
S7136H or AeroWave laminates. A high post-cure Tg (>280℃)
makes AeroBond350 prepreg an excellent choice for multi-layer
PCB platforms requiring sequential laminations as fully cured
AeroBond350 prepreg are capable of multiple lamination
cycles.

In addition, FR-4 compatible bond requirements (190℃) allow
AeroBond350 prepreg and low flow FR-4 prepreg to be combined
into non-homogenous multi-layer constructions using a
single bond cycle.

AeroBond350 prepreg is recognized by Under Writer Laboratories
with the UL-94 V-0 flame rating and is compatible with
lead-free processes..

• Auto Radar

• Base Station Transceivers

• Power Amplifiers

• RFID

• Telemetry

• DAS & CPE Antenna

• LNB

• Stable Dk/Df over Frequency and Temperature

• Low dielectric tolerance +/- 0.05

• Low Moisture Absorption

• Excellent Copper Peel Strength

• UL 94 V-0 Flame Rating

• Standard FR-4 PCB processes

 

AEROBOND 350

wdt_IDPROPERTYTypical ValueDirectionUnitsConditionTest Method
1 Dielectric Constant, εr (Process specification) 3.50±0.05 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1)Clamped Stripline
2 Dissipation Factor tan, δ 0.0033 - - 10GHz/23℃ 0
3 Volume Resistivity 1.5×108 - MΩ•cm E-24/125 IPC-TM-650 2.5.17.1
4 Surface Resistivity 6.7×106 - E-24/125 IPC-TM-650 2.5.17.1
5 Electrical Strength 45 Z KV/mm 0.51mm(0.020”) IPC-TM-650 2.5.6.2
6 Tensile Modulus 12,058 Y MPa RT ASTM D638
7 Tensile Strength 100 Y MPa RT ASTM D638
8 Flexural Strength 180 - MPa - IPC-TM-650 2.4.4
9 Tg(DSC) >280 - A IPC-TM-650 2.4.24
10 Td(TGA) >395 - - ASTM D3850


Standard Thickness Offerings

Standard Panel Sizes

0.004″ (0.101mm)

24”×18”(610mm×457mm)
Additional panel sizes may be available upon request

 

PRODUCT CONTACTS

David Barrell
Senior Director, OEM Marketing
RF Products North America
Email: DavidBarrell@syst.com.cn
Phone: 626-327-2056

Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet: Shengyi-AEROBOND350-DS-rv1.-3-17

SCGA-500 GF220
ULTRA LOW LOSS PTFE WOVEN GLASS MATERIALS

SCGA-500 GF220  Ultra Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms that extend into the millimeter range.

SCGA-500 GF220 PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (2.20 Dk +/- 0.02) and Dissipation Factor (0.0009) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).

SCGA-500 GF220  materials exhibit excellent dimensional stability, chemical resistance, low moisture absorption and copper peels strength.

SCGA-500F GF220  Ultra Low Loss Materials are an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.Typical applications include Automotive Radar, Satellite Communications, Filters, Couplers, LNAs, Phased Array Antennas, Power Amplifiers, Avionics and Aerospace.

SCGA-500 GF220 materials are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.

• Automotive Radar

• Satellite Communications

• Filers, Couplers, LNAs

• Phased Array Antennas

• Power Amplifiers

• Avionics and Aerospace

• Consistent and Stable Dk/Df over Frequency and Temperature

• Ultra Low Loss

• Excellent Electrical and Mechanical Properties

• Dimensionally Stable

• Low Moisture Absorption

• Excellent Chemical Resistance

• UL 94 V-0 Flame Rating

• Excellent Price Performance Value

SCGA-500 GF220

SCGA-500 GF220PROPERTYTEST METHODUNITTYPICAL VALUE
1 Dielectric Constant, Dk (@10GHz) IPC-TM650 2.5.5.5 - 2.20±0.02
2 Dissipation Factor, Df (@10GHz) IPC-TM650 2.5.5.5 - 0.0009
3 Passive Inter-Modulation, PIM Summitek 1900b PIM Analyzer dBc -163
4 Thermal Expansion, CTE - X IPC-TM650 2.4.24 PPM/℃ 41
5 Thermal Expansion, CTE - Y IPC-TM650 2.4.24 PPM/℃ 30
6 Thermal Expansion, CTE - Z IPC-TM650 2.4.24 PPM/℃ 217
7 Peel Strength IPC-TM650 2.4.8 N/mm 1.2
8 Water Absorption IPC-TM650 2.6.2.1 % 0.007
9 Density ASTM D-792 g/cm³ 2.18
10 Thermal Conductivity ASTM C518 W/m.K 0.27


 

Standard THIckness Offerings

Standard Panel Sizes

Standard Copper Cladding

0.010” (0.254mm), 0.020” (0.508mm),

0.030” (0.762mm), 0.060” (1.524mm)

36” x 48” & 40”x48”

Additional sizes may be available upon request

1/2 oz. (17  m), 1 oz. (35   m)

electrodeposited copper foil

 

 

PRODUCT CONTACTS

David Barrell
Senior Director, OEM Marketing
RF Products North America
Email: DavidBarrell@syst.com.cn
Phone: 626-327-2056

Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet: Shengyi-SCGA-500 GF220-DS-rv1.-3-17

Process Guidelines Datasheet:   SCGA-500 Series-Process Guidelines

Material Safety Datasheet:   SCGA-500 GF220 MSDS

SCGA-500 GF265
LOW LOSS PTFE WOVEN GLASS MATERIALS

SCGA-500 GF265  Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms.

SCGA-500 GF265 PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (2.65Dk +/- 0.04) and Dissipation Factor (0.0017) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).

SCGA-500 GF265 RF/Microwave Low Loss controlled dielectric Materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils).

SCGA-500F GF265  Low Loss Materials are an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.

Typical applications include Base Station Antennas, Power Amplifiers, Phased Array Antennas, Satellite Communications, Telemetry, Filters, Couplers and LNA’s.

SCGA-500 GF265 materials are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.

 

• Base Station Antennas

• Power Amplifiers

• Phased Array Antennas

• Satellite Communications

• Telemetry

• Filters, Couplers, LNA’s

• Consistent and Stable Dk/Df over Frequency and Temperature

• Extremely Low Loss

• Excellent Electrical and Mechanical Properties

• Dimensionally Stable

• Low Moisture Absorption

• Passive Inter-Modulation -163 dBc

• Excellent Chemical Resistance

• UL 94 V-0 Flame Rating

• Excellent Price Performance Value

SCGA-500 GF265

wdt_IDPROPERTYTEST METHODUNITTYPICAL VALUE
1 Dielectric Constant, Dk (@10GHz) IPC-TM650 2.5.5.5 - 2.65±0.04
2 Dissipation Factor, Df (@10GHz) IPC-TM650 2.5.5.5 - 0.0017
3 Passive Inter-Modulation, PIM Summitek 1900b PIM Analyzer dBc -163
4 Thermal Expansion, CTE - X IPC-TM650 2.4.24 PPM/℃ 9.2
5 Thermal Expansion, CTE - Y IPC-TM650 2.4.24 PPM/℃ 8.8
6 Thermal Expansion, CTE - Z IPC-TM650 2.4.24 PPM/℃ 118
7 Peel Strength IPC-TM650 2.4.8 N/mm 1.2
8 Water Absorption IPC-TM650 2.6.2.1 % 0.007
9 Density ASTM D-792 g/cm³ 2.22
10 Thermal Conductivity ASTM C518 W/m.K 0.28


Standard THIckness Offerings

Standard Panel Sizes

Standard Copper Cladding

0.010” (0.254mm), 0.020” (0.508mm),

0.030” (0.762mm), 0.060” (1.524mm)

36” x 48” & 40”x48”

Additional sizes may be available upon request

1/2 oz. (17  m), 1 oz. (35   m)

electrodeposited copper foil

 

 

PRODUCT CONTACTS

David Barrell
Senior Director, OEM Marketing
RF Products North America
Email: DavidBarrell@syst.com.cn
Phone: 626-327-2056

Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet: Shengyi-SCGA-500 GF265-DS-rv1.-3-17

Process Guidelines Datasheet:  SCGA-500 Series-Process Guidelines

Material Safety Datasheet:  SCGA-500 GF265 MSDS

SCGA-500 GF265(255)
LOW LOSS PTFE WOVEN GLASS MATERIALS

SCGA-500 GF265(255) Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms.

SCGA-500 GF265(255) PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (2.55Dk +/- 0.04) and Dissipation Factor (0.0014) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).

SCGA-500 GF265(255) RF/Microwave Low Loss controlled dielectric Materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils).

SCGA-500F GF265(255) Low Loss Materials are an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.

Typical applications include Base Station Antennas, Power Amplifiers, Satellite Communications, DAS and CPE Antenna, Automotive Radar and Wireless Communications.

SCGA-500 GF265(255) materials are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.

• Base Station Antennas

• Power Amplifiers

• Satellite Communications

• DAS & CPE Antennas

• Automotive Radar

• Wireless Communications

• Consistent and Stable Dk/Df over Frequency and Temperature

• Extremely Low Loss

• Excellent Electrical and Mechanical Properties

• Dimensionally Stable

• Low Moisture Absorption

• Passive Inter-Modulation -163 dBc

• Excellent Chemical Resistance

• UL 94 V-0 Flame Rating

• Excellent Price Performance Value

SCGA-500 GF265(255)

wdt_IDPROPERTYTEST METHODUNITTYPICAL VALUE
1 Dielectric Constant, Dk (@10GHz) IPC-TM650 2.5.5.5 - 2.65±0.04
2 Dissipation Factor, Df (@10GHz) IPC-TM650 2.5.5.5 - 0.0014
3 Passive Inter-Modulation, PIM Summitek 1900b PIM Analyzer dBc -163
4 Thermal Expansion, CTE - X IPC-TM650 2.4.24 PPM/℃ 8.2
5 Thermal Expansion, CTE - Y IPC-TM650 2.4.24 PPM/℃ 7.9
6 Thermal Expansion, CTE - Z IPC-TM650 2.4.24 PPM/℃ 145
7 Peel Strength IPC-TM650 2.4.8 N/mm 1.2
8 Water Absorption IPC-TM650 2.6.2.1 % 0.007
9 Density ASTM D-792 g/cm³ 2.25
10 Thermal Conductivity ASTM C518 W/m.K 0.29


 

 

Standard THIckness Offerings

Standard Panel Sizes

Standard Copper Cladding

0.010” (0.254mm), 0.020” (0.508mm),

0.030” (0.762mm), 0.060” (1.524mm)

36” x 48” & 40”x48”

Additional sizes may be available upon request

1/2 oz. (17  m), 1 oz. (35   m)

electrodeposited copper foil

PRODUCT CONTACTS

David Barrell
Senior Director, OEM Marketing
RF Products North America
Email: DavidBarrell@syst.com.cn
Phone: 626-327-2056

Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet: Shengyi-SCGA-500 GF265(255)-DS-rv1.-3-17

Process Guidelines Datasheet:  SCGA-500 Series-Process Guidelines

Material Safety Datasheet:  SCGA-500 GF265 MSDS

SCGA-500 GF300
LOW LOSS PTFE WOVEN GLASS MATERIALS

SCGA-500 GF300  Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms.

SCGA-500 GF300 PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (3.00 Dk +/- 0.04) and Dissipation Factor (0.0023) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).

SCGA-500 GF300 RF/Microwave Low Loss controlled dielectric Materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils).

SCGA-500 GF300  Low Loss Materials are an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.

Typical applications include Base Station Antennas, Power Amplifiers, Antenna Feed Networks, Passive Components, Telemetry, DAS and CPE Antennas.

SCGA-500 GF300 are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.

• Base Station Antennas

• Power Amplifiers

• Antenna Feed Networks

• Passive Components

• Telemetry

• DAS and CPE Antennas    

• Consistent and Stable Dk/Df over Frequency and Temperature

• Extremely Low Loss

• Excellent Electrical and Mechanical Properties

• Dimensionally Stable

• Low Moisture Absorption

• Passive Inter-Modulation -163 dBc

• Excellent Chemical Resistance

• UL 94 V-0 Flame Rating

• Excellent Price Performance Value

SCGA-500 GF300

wdt_IDPROPERTYTEST METHODUNITTYPICAL VALUE
1 Dielectric Constant, Dk (@10GHz) IPC-TM650 2.5.5.5 - 3.00±0.04
2 Dissipation Factor, Df (@10GHz) IPC-TM650 2.5.5.5 - 0.0023
3 Passive Inter-Modulation, PIM Summitek 1900b PIM Analyzer dBc -163
4 Thermal Expansion, CTE - X IPC-TM650 2.4.24 PPM/℃ 6.2
5 Thermal Expansion, CTE - Y IPC-TM650 2.4.24 PPM/℃ 8.6
6 Thermal Expansion, CTE - Z IPC-TM650 2.4.24 PPM/℃ 95
7 Peel Strength IPC-TM650 2.4.8 N/mm 1.2
8 Water Absorption IPC-TM650 2.6.2.1 % 0.01
9 Density ASTM D-792 g/cm³ 2.27
10 Thermal Conductivity ASTM C518 W/m.K 0.28


 

Standard THIckness Offerings

Standard Panel Sizes

Standard Copper Cladding

0.010” (0.254mm), 0.020” (0.508mm),

0.030” (0.762mm), 0.060” (1.524mm)

36” x 48” & 40”x48”

Additional sizes may be available upon request

1/2 oz. (17  m), 1 oz. (35   m)

electrodeposited copper foil

PRODUCT CONTACTS

David Barrell
Senior Director, OEM Marketing
RF Products North America
Email: DavidBarrell@syst.com.cn
Phone: 626-327-2056

Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet: Shengyi-SCGA-500 GF300-DS-rv1.-3-17

Process Guidelines Datasheet:  SCGA-500 Series-Process Guidelines

Material Safety Datasheet:  SCGA-500 GF300 MSDS

SCGA-500 GF300(294)
LOW LOSS PTFE WOVEN GLASS MATERIALS

SCGA-500 GF300 (294) Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms.

SCGA-500 GF300 (294) PTFE Woven Glass Controlled Dielectric Materials exhibit excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (2.94 Dk +/- 0.05) and Dissipation Factor (0.0025) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).

SCGA-500 GF300 (294) RF/Microwave Low Loss controlled dielectric Materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils).

SCGA-500 GF300 (294)  Low Loss Materials are an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.

Typical applications include Base Station Antennas, Power Amplifiers, Antenna Feed Networks, Passive Components, Telemetry, DAS and CPE Antennas.

SCGA-500 GF300 (294) are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.

 

• Base Station Antennas

• Power Amplifiers

• Antenna Feed Networks

• Passive Components

• Telemetry

• DAS and CPE Antennas   

• Consistent and Stable Dk/Df over Frequency and Temperature

• Extremely Low Loss

• Excellent Electrical and Mechanical Properties

• Dimensionally Stable

• Low Moisture Absorption

• Passive Inter-Modulation -163 dBc

• Excellent Chemical Resistance

• UL 94 V-0 Flame Rating

• Excellent Price Performance Value

SCGA-500 GF300 (294)

wdt_IDPROPERTYTEST METHODUNITTYPICAL VALUE
1 Dielectric Constant, Dk (@10GHz) IPC-TM650 2.5.5.5 - 2.94±0.04
2 Dissipation Factor, Df (@10GHz) IPC-TM650 2.5.5.5 - 0.0025
3 Passive Inter-Modulation, PIM Summitek 1900b PIM Analyzer dBc -163
4 Thermal Expansion, CTE - X IPC-TM650 2.4.24 PPM/℃ 6.8
5 Thermal Expansion, CTE - Y IPC-TM650 2.4.24 PPM/℃ 8.6
6 Thermal Expansion, CTE - Z IPC-TM650 2.4.24 PPM/℃ 95
7 Peel Strength IPC-TM650 2.4.8 N/mm 1.2
8 Water Absorption IPC-TM650 2.6.2.1 % 0.01
9 Density ASTM D-792 g/cm³ 2.27
10 Thermal Conductivity ASTM C518 W/m.K 0.28


 

 

Standard THIckness Offerings

Standard Panel Sizes

Standard Copper Cladding

0.010” (0.254mm), 0.020” (0.508mm),

0.030” (0.762mm), 0.060” (1.524mm)

36” x 48” & 40”x48”

Additional sizes may be available upon request

1/2 oz. (17  m), 1 oz. (35   m)

electrodeposited copper foil

 

PRODUCT CONTACTS

David Barrell
Senior Director, OEM Marketing
RF Products North America
Email: DavidBarrell@syst.com.cn
Phone: 626-327-2056

Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet: Shengyi-SCGA-500 GF300 (294)-DS-rv1.-3-17

Process Guidelines Datasheet:  SCGA-500 Series-Process Guidelines

Material Safety Datasheet:  SCGA-500-GF300294-MSDS