High Speed Digital

SHENGYI TECHNOLOGY — HIGH SPEED DIGITAL PRODUCTS

SYNAMIC 6N
ULTRA HIGH SPEED & ULTRA LOW LOSS LAMINATES AND PREPREGS

Synamic 6N is a proprietary high performance 205℃(DSC) glass transition temperature (Tg) PPE system for multilayer Printed Wiring Board(PWB) engineered for feature rich high speed digital (HSD) applications that require maximum electrical performance (up to 50 Gbs+/channel). It also provides superior thermal and reliability performance.

Synamic 6N has a Dielectric Constant (Dk) and Dissipation Factor (Df) of 3.35 and 0.0026 at 10 GHz using the IPC 2.5.5.5 test method. The system also exhibits a stable Dk & Df over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +125 ºC). It is also compatible with high layer count applications that require multiple 2 oz. copper layers and that have 0.8mm pitch It also has demonstrated excellent CAF resistance down to 0.8mm pitch when tested using industry standard CAF TVs across multiple OEMs.

The Synamic 6N system is available in spread and standard low Dk glass. The same resin system is available using standard E-Glass under the name Synamic 6N. Both are supplied with a 2um Rz roughness VLP copper as the default offering.

• High Speed Servers (25 – 50 Gbs/channel)

• High Speed SANs (25 – 50 Gbs/channel)

• Switches & Routers (25 – 50 Gbs/channel)

• High Layer Count Backplanes

• High Layer Count Line Cards

• Multiple 2 oz. Copper Layers

• 0.8mm Pitch

• Burn-in Boards

• HDI Builds

• Hybrid Builds

• Military & Aerospace

• Excellent Electrical Performance

• 3.35 Dk & 0.0026 Df @ 10 GHz (IPC 2.5.5.5)

• Stable Dk/Df over Frequency and Temperature

• Excellent Thermal Performance

• High Tg: 210 deg C

• Low CTE @ 45/180 ppm/°C

• High Td: 405°C (TGA @ 5% wt loss)

• Superior CAF Performance

• Excellent Performance in Hybrid and HDI Designs

• UL 94 V-0 Flame Rating

• Standard FR-4 PCB processes

Synamic 6N

wdt_ID POPERTY TYPE PROPERTY Typical Value Unit Condition Test Method
1 Thermal Glass Transition Temperature, Tg 210 °C A DMA IPC-TM-650 2.4.24.2
2 Thermal Glass Transition Temperature, Tg 205 °C A DSC IPC-TM-650 2.4.25
3 Thermal Thermal Expansion, Z CTE 45 ppm/°C A Before Tg, IPC-TM-650 2.4.24
4 Thermal Thermal Expansion, Z CTE 180 ppm/°C A After Tg, IPC-TM-650 2.4.24
5 Thermal Decomposition Temperature, Td 405 °C A TMA IPC-TM650 2.4.24.6
6 Thermal Delamination Time, T288 >120 minutes A TMA IPC-TM650 2.4.24
7 Thermal Delamination Time, T300 >60 minutes A TMA IPC-TM650 2.4.24
8 Thermal Humidity Resistance >10 cycles 85°C/85%RH/168 Hours 288°C/10sec Dipping -
9 Electrical Dielectric Constant (Dk) 3.31 - 1 GHz IPC-TM-650 2.5.5.9
10 Electrical Dielectric Constant (Dk) 3.35 - 10 GHz IPC-TM-650 2.5.5.5

Standard Offerings

Standard Panel Sizes

Thickness – 0.002”(0.05mm) to 0.060” (1.5mm)

Copper – VLP with 2um Rz

Low Dk Glass – Spread & Standard

18” x 24” & 21”x24”

Additional panel sizes may be available upon request For most application the standard EDC foil should be used. When PIM and insertion loss is critic the RTF low profile copper foil should be considered.

PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email: Fred@shengyi-usa.com
Phone: 602-722-4053

BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

Click on the link to download the document

Technical Datasheet: Synamic 6N-TDS

Lineups & Prepregs:  SYNAMIC-6N-LINEUP-PREPREG.pdf

Process Guide Lines: SYNAMIC 6N/6NB-Process Guide Lines

Material Safety Sheet:  SYNAMIC 6N-Material Safety,  SYNAMIC 6NB-Material Safety DS

 

SYNAMIC 6
ULTRA HIGH SPEED & ULTRA LOW LOSS LAMINATES AND PREPREGS

Synamic 6 is a proprietary high performance 210°C (DSC) glass transition temperature (Tg) PPE system for multilayer Printed Wiring Board(PWB) engineered for high speed digital (HSD) applications that require superior electrical performance (25 Gbs+/channel). It also provides superior thermal and reliability performance.

Synamic 6  has a Dielectric Constant (Dk) and Dissipation Factor (Df) of 3.50 and 0.0046 at 10 GHz using the IPC 2.5.5.5 test method. The system also exhibits a stable Dk & Df over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +125 ºC). It is also compatible with high layer count applications that require multiple 2 oz. copper layers and that have 0.8mm pitch  It also has demonstrated excellent CAF resistance down to 0.8mm pitch when tested using industry standard CAF TVs across multiple OEMs.

The Synamic 6 system is available in spread and standard E-Glass. The same resin system is available using low Dk glass under the name Synamic 6N. Both are supplied with a 2um Rz roughness VLP copper as the default offering.

• High Speed Servers (25 Gbs+/channel)

• High Speed SANs (25 Gbs+/channel)

• Switches & Routers (25 GBs+/channel)

• High Layer Count Backplanes

• High Layer Count Line Cards

• Multiple 2 oz. Copper Layers

• 0.8mm Pitch

• Burn-in Boards

• HDI Builds

• Hybrid Builds

• Military & Aerospace

• Excellent Electrical Performance

• 3.5 Dk & 0.0046 Df @ 10 GHz (IPC 2.5.5.5)

• Stable Dk/Df over Frequency and Temperature

• Excellent  Thermal Performance

• High Tg: 210°C (DSC)

• Low CTE @ 45/180 ppm/°C

• High Td: 405°C (TGA @ 5% wt loss)

• Superior CAF Performance

• Excellent Performance in Hybrid and HDI Designs

• UL 94 V-0 Flame Rating

• Standard FR-4 PCB processes

Synamic 6

wdt_ID POPERTY TYPE PROPERTY Typical Value Unit Condition Test Method
1 Thermal Glass Transition Temperature, Tg 210 °C A DMA IPC-TM-650 2.4.24.2
2 Thermal Glass Transition Temperature, Tg 210 °C A DSC IPC-TM-650 2.4.25
3 Thermal Thermal Expansion, Z CTE 45 ppm/°C A Before Tg, IPC-TM-650 2.4.24
4 Thermal Thermal Expansion, Z CTE 180 ppm/°C A After Tg, IPC-TM-650 2.4.24
5 Thermal Decomposition Temperature, Td 405 °C A TMA IPC-TM650 2.4.24.6
6 Thermal Delamination Time, T288 >120 minutes A TMA IPC-TM650 2.4.24
7 Thermal Delamination Time, T300 >60 minutes A TMA IPC-TM650 2.4.24
8 Thermal Humidity Resistance >10 cycles 85°C/85%RH/168 Hours 288°C/10sec Dipping -
9 Electrical Dielectric Constant (Dk) 3.64 - 1 GHz IPC-TM-650 2.5.5.9
10 Electrical Dielectric Constant (Dk) 3.5 - 10 GHz IPC-TM-650 2.5.5.5

Standard Offerings

Standard Panel Sizes

Thickness – 0.002”(0.05mm)to 0.060” (1.5mm)

Copper – VLP with 2um Rz

E-Glass – Spread & Standard

18” x 24” & 21”x24”

Additional sizes may be available upon request For most application the standard EDC foil should be used. When PIM and  insertion loss is critic the RTF low profile copper foil should be considered.

PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email:Fred@shengyi-usa.com
Phone: 602-722-4053

BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

Click on the link to download the file

Technical Datasheet:  SYNAMIC 6 - TDS

Lineups & Prepregs:  SYNAMIC-6-LINEUP-PREPREG.pdf

Process Guide Lines:  SYNAMIC 6/6B-Process Guide Lines

Safety Materials Sheet:  SYNAMIC 6:6B-Material Safety

 

 

SYNAMIC 8G
HALOGEN-FREE HIGH SPEED & ULTRA LOW LOSS LAMINATES AND PREPREGS

Synamic 8G is a proprietary high performance 190°C (DSC) glass transition temperature (Tg) PPE system for multilayer Printed Wiring Board(PWB) engineered for high speed digital (HSD) applications that require superior electrical performance (25Gbs+/channel). It also provides superior thermal and reliability performance.

Synamic 8G has a Dielectric Constant (Dk) and Dissipation Factor (Df) of 3.68 and 0.0032 at 10 GHz using the IPC 2.5.5.5 test method. The system also exhibits a stable Dk & Df over a widerange of frequencies (1 GHz to 40 GHz ) and temperatures (-40 ºC to +125 ºC). It is also compatible with high layer count applications that require multiple 2 oz. copper layers and that have 0.8mm pitch It also has demonstrated excellent CAF resistance down to 0.8mm pitch when tested using industry standard CAF TVs across multiple OEMs.

The Synamic 8G system is available in spread and standard E-Glass. It is supplied with a 1.3um Rz roughness HVLP copper as the default offering, and may also offer 2um RTF for server application.

• High Speed Servers

• High Speed SANs

• Switches & Routers

• High Layer Count Backplanes

• High Layer Count Line Cards

• Multiple 2 oz. Copper Layers

• 0.8mm Pitch

• HDI Builds

• Hybrid Builds

• Excellent Thermal Performance

• High Tg: 190℃ (DSC)

• Low CTE @ 48/180 ppm/°C

• High Td: 430°C (TGA @ 5% wt loss)

• Excellent Electrical Performance

• 3.68 Dk & 0.0032Df @ 10 GHz (IPC 2.5.5.5)

• Stable Dk/Df over Frequency and Temperature

• Superior CAF Performance

• UL 94 V-0 Flame Rating & Halogen-Free

Synamic 8G

wdt_ID POPERTY TYPE PROPERTY Typical Value Unit Condition Test Method
1 Thermal Glass Transition Temperature, Tg 200 °C A DMA IPC-TM-650 2.4.24.2
2 Thermal Glass Transition Temperature, Tg 190 °C A DSC IPC-TM-650 2.4.25
3 Thermal Thermal Expansion, Z CTE 48 ppm/°C A Before Tg, IPC-TM-650 2.4.24
4 Thermal Thermal Expansion, Z CTE 180 ppm/°C A After Tg, IPC-TM-650 2.4.24
5 Thermal Decomposition Temperature, Td 430 °C A TMA IPC-TM650 2.4.24.6
6 Thermal Delamination Time, T288 60 minutes A TMA IPC-TM650 2.4.24
7 Thermal Delamination Time, T300 60 minutes A TMA IPC-TM650 2.4.24
8 Thermal Humidity Resistance >10 cycles 85°C/85%RH/168 Hours 288°C/10sec Dipping -
9 Electrical Dielectric Constant (Dk) 3.73 - 1 GHz IPC-TM-650 2.5.5.9
10 Electrical Dielectric Constant (Dk) 3.68 - 10 GHz IPC-TM-650 2.5.5.5

Standard Offerings

Standard Panel Sizes

Thickness – 0.002”(0.05mm)to 0.060” (1.5mm)

Copper – HVLP with 1.3um Rz/ RTF with 2um Rz

E-Glass – Spread & Standard

18” x 24” & 21”x24”

Additional sizes may be available upon request For most application the standard EDC foil should be used. 

PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email:Fred@shengyi-usa.com
Phone: 602-722-4053

BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

Click on the link to download the file

Technical Datasheet: 

Process Guide Lines: 

Safety Materials Sheet: 

 

S7439
HIGH SPEED & LOW LOSS LAMINATES AND PREPREGS

S7439 is a proprietary high performance 200℃(DSC) glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) engineered for applications that require excellent electrical, thermal and reliability performance.

S7439  has a Dielectric Constant (Dk) and Dissipation Factor (Df) of 3.80 and 0.0068 at 10 GHz using the IPC 2.5.5.5 test method. The system also exhibits a stable Dk & Df over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +125 ºC). It is also compatible with high layer count applications that require multiple 2 oz. copper layers and that have 0.8mm pitch.  It also has demonstrated excellent CAF resistance down to 0.7mm pitch when tested using industry standard CAF TVs across multiple OEMs.

The S7439 system is available in spread and standard E-Glass. It is supplied with a 3um Rz roughness VLP copper as the default offering. A 2um VLP copper is also available if additional electrical bandwidth is needed.

• High Speed Servers

• High Speed SANs

• Switches & Routers

• High Layer Count Backplanes

• High Layer Count Line Cards

• Multiple 2 oz. Copper Layers

• 0.8mm Pitch

• Burn-in Boards

• HDI Builds

• Hybrid Builds

• Military & Aerospace

• Excellent  Thermal Performance

• High Tg: 200℃ (DSC)

• Low CTE @ 45/210 ppm/°C

• High Td: 385°C (TGA @ 5% wt loss)

• Excellent Electrical Performance

• 3.8 Dk & 0.0068 Df @ 10 GHz (IPC 2.5.5.5)

• Stable Dk/Df over Frequency and Temperature

• Superior CAF Performance

• Excellent Performance in Hybrid and HDI Designs

• UL 94 V-0 Flame Rating

• Standard FR-4 PCB processes

S7439

wdt_ID POPERTY TYPE PROPERTY Typical Value UNIT Condition Test Method
1 Thermal Glass Transition Temperature, Tg 205 °C A DMA IPC-TM-650 2.4.24.2
2 Thermal Glass Transition Temperature, Tg 200 °C A DSC IPC-TM-650 2.4.25
3 Thermal Thermal Expansion, Z CTE 45 ppm/°C A Before Tg, IPC-TM-650 2.4.24
4 Thermal Thermal Expansion, Z CTE 210 ppm/°C A After Tg, IPC-TM-650 2.4.24
5 Thermal Decomposition Temperature, Td 385 °C A TMA IPC-TM650 2.4.24.6
6 Thermal Delamination Time, T288 120 minutes A TMA IPC-TM650 2.4.24
7 Thermal Delamination Time, T300 60 minutes A TMA IPC-TM650 2.4.24
8 Thermal Humidity Resistance >10 cycles 85°C/85%RH/168 Hours 288°C/10sec Dipping -
9 Electrical Dielectric Constant (Dk) 3.85 - 1 GHz IPC-TM-650 2.5.5.9
10 Electrical Dielectric Constant (Dk) 3.8 - 10 GHz IPC-TM-650 2.5.5.5

Standard Offerings

Standard Panel Sizes

Thickness – 0.002”(0.05mm) to 0.060” (1.5mm)

Copper – VLP with 3um Rz

E-Glass – Spread & Standard

18” x 24”, 21”x24” & 27” x 24”

Additional panel sizes may be available upon request For most application the standard EDC foil should be used. When PIM and insertion loss is critic the RTF low profile copper foil should be considered.

PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email:Fred@shengyi-usa.com
Phone: 602-722-4053

BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

Technical Datasheet:  S7439-TDS

Lineups & Prepregs:  Shengyi-S7439-LINEUPS-PREPREG.pdf

Process Guide Lines:  S7439 - PG

Safety Materials Sheet:  S7439 - MSDS, S7439B - MSDS

 

S7439G
HALOGEN-FREE & LOW LOSS LAMINATES AND PREPREGS

S7439G is a proprietary halogen-free high performance 180℃(DSC) glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) engineered for applications that require excellent electrical, thermal and reliability performance.

S7439G has a Dielectric Constant (Dk) and Dissipation Factor (Df) of 3.86 and 0.0070 at 10 GHz using the IPC 2.5.5.5 test method. The system also exhibits a stable Dk & Df over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +125 ºC). It is also compatible with high layer count applications that require multiple 2 oz. copper layers and that have 0.8mm pitch. It also has demonstrated excellent CAF resistance down to 0.7mm pitch when tested using industry standard CAF TVs across multiple OEMs.

The S7439G system is available in spread and standard E-Glass. It is supplied with a 3um Rz roughness VLP copper as the default offering. A 2um VLP copper is also available if additional electrical bandwidth is needed.

• High Speed Servers

• High Speed SANs

• Switches & Routers

• High Layer Count Backplanes

• High Layer Count Line Cards

• Multiple 2 oz. Copper Layers

• 0.8mm Pitch

• Burn-in Boards

• HDI Builds

• Hybrid Builds

• Excellent Thermal Performance

• High Tg: 180℃ (DSC)

• Low CTE @ 50/240 ppm/°C

• High Td: 404°C (TGA @ 5% wt loss)

• Excellent Electrical Performance

• 3.86 Dk & 0.0070 Df @ 10 GHz (IPC 2.5.5.5)

• Stable Dk/Df over Frequency and Temperature

• Superior CAF Performance

• UL 94 V-0 Flame Rating

• Standard FR-4 PCB processes

S7439G

wdt_ID PROPERTY TYPICAL VALUE UNITS CONDITION TEST METHOD
1 Glass Transition Temperature, Tg 190-180 °C A DMA IPC-TM-650 2.4.24.2 DSC IPC-TM-650 2.4.25
2 Thermal Expansion, Z-CTE 50-240 ppm/°C A Before Tg, IPC-TM-650 2.4.24 After Tg, IPC-TM-650 2.4.24
3 Decomposition Temperature, Td 404 °C A TMA IPC-TM650 2.4.24.6
4 Delamination Time, T288 60 minutes A TMA IPC-TM650 2.4.24
5 Delamination Time, T300 60 minutes A TMA IPC-TM650 2.4.24
6 Humidity Resistance ＞10 cycles 85°C/85%RH/168 Hours - 288°C/10sec Dipping -
7 Dielectric Constant (Dk) 3.93-3.86 - 1 GHz -10 GHz IPC-TM-650 2.5.5.9 IPC-TM-650 2.5.5.5
8 Dissipation Factor (Df) 0.0043-0.0070 - 1 GHz -10 GHz IPC-TM-650 2.5.5.9 IPC-TM-650 2.5.5.5
9 Volume Resistivity 1.15×108 MΩ•cm A IPC-TM-650 2.5.17.1
10 Surface Resistivity 8.50×106 MΩ A IPC-TM-650 2.5.17.1

Standard Offerings

Standard Panel Sizes

Thickness – 0.002”(0.05mm) to 0.060” (1.5mm)

Copper – VLP with 3um Rz

E-Glass – Spread & Standard

18” x 24”, 21”x24” & 27” x 24”

Additional panel sizes may be available upon request For most application the standard EDC foil should be used. When PIM and insertion loss is critic the RTF low profile copper foil should be considered.

PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email:Fred@shengyi-usa.com
Phone: 602-722-4053

BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746

BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158

Technical Datasheet: S7439G TDS

Lineups & Prepregs:

Process Guide Lines:

Safety Materials Sheet:

 

S7040G
HALOGEN FREE & MID LOSS MATERIAL

S7040G is a proprietary halogen-free high performance 175℃(DSC) glass transition temperature (Tg) modified FR-4 system for multilayer Printed Wiring Board (PWB) engineered for applications that require excellent electrical, thermal and reliability performance.

S7040G has a Dielectric Constant (Dk) and Dissipation Factor (Df) of 3.72 and 0.0089 at 10 GHz using the IPC 2.5.5.5 test method. The system also exhibits a stable Dk & Df over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +125 ºC). It is also compatible with high layer count applications that require multiple 2 oz. copper layers and that have 0.8mm pitch. It also has demonstrated excellent CAF resistance down to 0.8mm pitch when tested using industry standard CAF TVs across multiple OEMs.

The S7040G system is available in spread E-Glass. It is supplied with a 4um Rz roughness RTF copper foil as the default offering. A 2um RTF copper is also available if additional electrical bandwidth is needed.

• Server, Switch, Routers and Base station

• Backplane, Line cards

• High Tg 175℃ (DSC);

• Lower insertion loss, Dk/Df@1GHz: 3.72/0.0089;

• Lower Z-axis CTE, offering superior PTH Reliability;

• Excellent Anti-CAF Performance;

• Halogen free and compatible with lead free process.

S7040GB

wdt_ID TEST ITEMS TREATMENT CONDITION UNIT SPEC TYPICAL VALUE
27 Tg DMA ˚C - 185
28 Tg DSC ˚C - 175
29 Flammability C-48/23/50,E-24/125 Rating V-0 V-0
31 Volume Resistivity After moisture resistance MΩ-cm ≥106 3.50×107
32 Volume Resistivity E-24/125 MΩ-cm ≥103 8.70×107
33 Surface Resistivity After moisture resistance MΩ ≥104 1.50×107
34 Surface Resistivity E-24/125 MΩ ≥103 6.70×107
35 Dielectric Breakdown D-48/50+D-0.5/23 kV ≥40 45+kV NB
36 Dielectric Constant RC 55% IPC-TM-650 2.5.5.9 (1GHz) - ≤5.4 3.9
37 Dielectric Constant RC 55% IPC-TM-650 2.5.5.13(10GHz) - ≤5.4 3.72

PRODUCT CONTACTS

FRED HICKMAN
VP of NA HSD OEM Marketing
Email:Fred@shengyi-usa.com
Phone: 602-722-4053

Click on the link to download the file

 

Technical Datasheet:  S7040G DS