Lead-Free Compatible FR-4
SHENGYI TECHNOLOGY — Lead-Free Compatible FR-4 PRODUCTS- S1000-2 APPLICATIONS
- FEATURES
- GENERAL PROPERTIES
- PRODUCT SPECIFICATION
- PRODUCT CONTACTS
- DOCUMENT DOWNLOADS
• Servers
• Storage Area Networks (SANs)
• Switches & Routers
• High Layer Count PCBs
• Computers
• Medical
• Test
• Leadfree Compatible FR4 Laminates & Prepregs
• Tg: 180°C (DSC)
• High Heat Resistance
• Low Z-Axis CTE
• Excellent Through Hole Reliability
• Superior CAF Performance
• Low Water Absorption
• UL 94 V-0 Flame Rating
S1000-2
| wdt_ID | POPERTY TYPE | PROPERTY | Typical Value | UNIT | Condition | Test Method |
|---|---|---|---|---|---|---|
| 1 | Thermal | Glass Transition Temperature, Tg | 185 | °C | A | DMA IPC-TM-650 2.4.24.2 |
| 2 | Thermal | Glass Transition Temperature, Tg | 180 | °C | A | DSC IPC-TM650 2.4.25 |
| 3 | Thermal | Thermal Expansion, Z CTE | 45 | ppm/°C | A | Before Tg, IPC-TM-650 2.4.41 |
| 4 | Thermal | Thermal Expansion, Z CTE | 220 | ppm/°C | A | After Tg, IPC-TM-650 2.4.41 |
| 5 | Thermal | Decomposition Temperature, Td | 345 | °C | A | TMA IPC-TM650 2.4.24.6 |
| 6 | Thermal | Delamination Time, T260 | 60 | minutes | A | TMA IPC-TM650 2.4.24 |
| 7 | Thermal | Delamination Time, T288 | 20 | minutes | A | TMA IPC-TM650 2.4.24 |
| 8 | Thermal | Delamination Time, T300 | 5 | minutes | A | TMA IPC-TM650 2.4.24 |
| 9 | Electrical | Dielectric Constant (Dk) | 4.8 | - | 1 MHz | IPC-TM-650 2.5.5.9 |
| 10 | Electrical | Dissipation Factor (Df) | 0.013 | - | 1 MHz | IPC-TM-650 2.5.5.9 |
|
Thickness |
Copper Foil |
Standard Size |
|
0.002”-0.125” (0.5mm to 3.2mm) |
3/8 oz. – 3oz. (12um – 105um) |
40” x 48” (1020mm x 1220mm) |
|
0.002”-0.125” (0.5mm to 3.2mm) |
3/8 oz. – 3oz. (12um – 105um) |
42” x 48” (1070mm x 1220mm) |
|
0.002”-0.125” (0.5mm to 3.2mm) |
3/8 oz. – 3oz. (12um – 105um) |
36” x 48” (915mm x 1220mm) |
PRODUCT CONTACTS
BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746
BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158
Click on the link to download the file
Technical Datasheet: S1000-2-DS
Process Guidelines Datasheet: S1000-2-Process Guidelines
Material Safety Datasheet: S1000-2-MSDS
- S1000-2M APPLICATIONS
- FEATURES
- GENERAL PROPERTIES
- PRODUCT SPECIFICATIONS
- PRODUCT CONTACT
- DOCUMENT DOWNLOADS
•High layer count PCBs
•Automotive Electronics
•Computing & Communications
•Military & Aerospace
•Lower Z-Axis CTE for improved through hole reliability
• Excellent Mechanical Processability and Thermal Resistance
• Leadfree Compatible & CAF Resistant
S1000-2M
| wdt_ID | POPERTY TYPE | PROPERTY | Typical Value | Units | Condition | Test Method |
|---|---|---|---|---|---|---|
| 1 | Thermal | Glass Transition Temperature, Tg | 185 | °C | A | DMA IPC-TM-650 2.4.24.2 |
| 2 | Thermal | Glass Transition Temperature, Tg | 180 | °C | A | DSC IPC-TM650 2.4.25 |
| 3 | Thermal | Thermal Expansion, Z CTE | 41 | ppm/°C | A | Before Tg, IPC-TM-650 2.4.41 |
| 4 | Thermal | Thermal Expansion, Z CTE | 208 | ppm/°C | A | After Tg, IPC-TM-650 2.4.41 |
| 5 | Thermal | Decomposition Temperature, Td | 355 | °C | A | TMA IPC-TM650 2.4.24.6 |
| 6 | Thermal | Delamination Time, T260 | 60 | minutes | A | TMA IPC-TM650 2.4.24 |
| 7 | Thermal | Delamination Time, T288 | 30 | minutes | A | TMA IPC-TM650 2.4.24 |
| 8 | Thermal | Delamination Time, T300 | 15 | minutes | A | TMA IPC-TM650 2.4.24 |
| 9 | Electrical | Dielectric Constant (Dk) - SPDR at 56% RC | 4.49 | - | 1 GHz | IPC-TM-650 2.5.5.9 |
| 10 | Electrical | Dielectric Constant (Dk) - SPDR at 56% RC | 4.9 | - | 1 MHz | IPC-TM-650 2.5.5.9 |
|
Thickness |
Copper Foil |
Standard Size |
|
0.002”-0.125” (0.5mm to 3.2mm) |
3/8 oz. – 3oz. (12um – 105um) |
40” x 48” (1020mm x 1220mm) |
|
0.002”-0.125” (0.5mm to 3.2mm) |
3/8 oz. – 3oz. (12um – 105um) |
42” x 48” (1070mm x 1220mm) |
|
0.002”-0.125” (0.5mm to 3.2mm) |
3/8 oz. – 3oz. (12um – 105um) |
36” x 48” (915mm x 1220mm) |
PRODUCT CONTACTS
BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746
BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158
Click on the link to download the file
Technical Datasheet: S1000-2M
Process Guidelines Datasheet: S1000-2M-Process Guidelines
Material Safety Datasheet: S1000-2M-MSDS
S1190
| wdt_ID | POPERTY TYPE | Typical Value | UNIT | Condition | Test Method |
|---|---|---|---|---|---|
| 1 | Thermal Glass Transition Temperature, Tg | 200 | °C | A | DMA IPC-TM-650 2.4.24.2 |
| 2 | Thermal Glass Transition Temperature, Tg | 190 | °C | A | DSC IPC-TM650 2.4.25 |
| 3 | Thermal Expansion, Z CTE | 45 | ppm/°C | A | Before Tg, IPC-TM-650 2.4.41 |
| 4 | Thermal Expansion, Z CTE | 210 | ppm/°C | A | After Tg, IPC-TM-650 2.4.41 |
| 5 | Thermal Decomposition Temperature, Td | 350 | °C | A | TMA IPC-TM650 2.4.24.6 |
| 6 | Thermal Delamination Time, T260 | 60 | minutes | A | TMA IPC-TM650 2.4.24.1 |
| 7 | Thermal Delamination Time, T288 | 45 | minutes | A | TMA IPC-TM650 2.4.24.1 |
| 8 | Electrical Dielectric Constant (Dk) | 4.6 | - | 1 GHz | IPC-TM-650 2.5.5.9 |
| 9 | Electrical Dielectric Constant (Dk) | 4.8 | - | 1 MHz | IPC-TM-650 2.5.5.9 |
| 10 | Electrical Dissipation Factor (Df) | 0.015 | - | 1 GHz | IPC-TM-650 2.5.5.9 |
PRODUCT CONTACTS
BRYAN WONG
Director of NA Sales
Email: bryan.wong@paramount-usa.com
Phone: 847-274-5746
BARRY O’REILLY
Director of NA Sales
Email: boreilly@midlanticpa.com
Phone: 610-212-3158
Click on the link to download the file
Technical Datasheet: S1190 DS
Process Guidelines Datasheet: S1190 Process Guidelines
Material Safety Datasheet: S1190 MSDS