AEROWAVE 300
HIGH FREQUENCY LOW LOSS MATERIALS

AeroWave 300 PPE woven glass-reinforced filled UL 94 V-0 circuit materials present a strong value proposition for today’s designer where cost, performance and manufacturability are paramount. AeroWave 300 materials can be fabricated using standard FR-4 printed circuitry fabrication processes. The AeroWave 300 materials well suited for use in hybrid multilayer printed circuit configurations and are compatible for use in lead free assembly processes.

AeroWave 300 materials exhibit excellent electrical and mechanical properties with a consistent and stable dielectric constant and dissipation factor over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +12 ºC).

AeroWave 300 low loss, (Df 0.0031 @ 10 GHz) controlled dielectric materials (Dk 3.0 +/- 0.05) are available in a broad range of nominal cores and pre-pregs. These products have been developed to provide unique material solutions for base station antennas and base station power amplifiers and other current and emerging RF/Microwave design requirements.

AeroWave 300 RF/Microwave low loss, controlled dielectric materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption, and copper peel strength. Passive Inter-modulation (PIM) performance values exceeding -158 dBc are typical (HVLP type of copper foil).

• Stable Dk/Df over frequency and temperature

• Tight Dk tolerance control +/-0.05

• Excellent copper peel strength

• UL 94 V-0 flame rating

• Thermal setting resin system with good PCB processibility and available for hybrid or multilayer design

• Cellular base station antennas

• Antenna feed networks

• Telemetry

• DAS & CPE antenna

• Massive MIMO antenna

AEROWAVE 300

wdt_ID PROPERTY Typical Value Direction Units Condition Test Method
1 Dielectric Constant (Process Dk) 3.0±0.05 Z - 10GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
2 Dielectric Constant (Design Dk) 2.98 Z - 1.5 GHz -6GHz/23℃ Differential Phase Length Method
3 Dissipation Factor, Df 0.0031 Z - 10GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
4 Thermal Coefficient of Dk 50 Z - -40~+120℃ IEC 61189-2-721 (10GHz)
5 Tg 200 - DMA IPC-TM-650 2.4.24.4
6 Td 400 - TGA ASTM D3850
7 Coefficient of Thermal Expansion 15 15 50 X Y Z ppm/℃ TMA IPC-TM-650 2.4.41
8 Volume Resistivity 2.21×10^8 - MΩ-cm A IPC-TM-650 2.5.17.1
9 Surface Resistivity 6.84×10^7 - A IPC-TM-650 2.5.17.1
10 Peel Strength 0.85 - N/mm after solder float 1 oz. HVLP foil IPC-TM-650 2.4.8

 

PRODUCT

Standard Thickness

Standard Panel Size

Copper Foil

AeroWave 300

0.005” 0.127mm)

0.010” 0.254mm)

0.020” 0.508mm)

0.030” 0.762mm)

0.060” 1.524mm)

36”×48”,40”×48”,42”×48”,
Additional panel sizes may be available upon request

 

HVLP type low profile
copper foil

 

 

 

PRODUCT CONTACTS

Oliver Zhu
VP of Global Marketing, RF Product
Email: Oliverzhu@syst.com.cn
Phone: +1-518-704-1007
 
Alex Luan
Manager of RF OEM Marketing
Shengyi Technology Co., Ltd. (China)
Email: luany@syst.com.cn
Phone: +86-188-2685-2598

 

 

Click on the link to download the file

 

Technical Datasheet:  AEROWAVE 300-TDS

Process Guidelines Datasheet:  AEROWAVE 300-Process-Guide-Lines.pdf

Material Safety Datasheet:  AEROWAVE-300-MSDS.pdf

mmWAVE
ULTRA LOW LOSS WOVEN GLASS PPE MATERIAL

mmWave is designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms that extend into the millimeter range. mmWave is a PPE Woven Glass Controlled Dielectric Material with excellent electrical and mechanical properties with a consistent and stable dielectric constant and dissipation factor over a wide range of frequencies and temperatures. mmWave exhibits excellent dimensional stability, chemical resistance and low moisture absorption.

• Automotive Radar

• Base Station Antenna

• GPS Systems

• Point to Point Antenna

• Telemetry

• Avionics & Aerospace

• DAS & CPE Antenna

• mmWave Applications

• Low CTE

• Stable Dk over Frequency and Temperature

• Ultra Low Loss

• Low Moisture Absorption

• Passive Inter-modulation -158 dBc

• Excellent Copper Peel Strength

• UL 94 V-0 Flame Rating

mmWave

wdt_ID PROPERTY Typical Value Direction Units Condition Test Method
1 Dielectric Constant, εr (Process specification) 3.00±0.05 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
2 Dielectric Constant, εr (Design specification) 3.064 Z 6GHz/23℃ Differential Phase Length Method
3 Dissipation Factor tan, δ 0.002 Z 10GHz/23℃ IPC-TM-650 2.5.5.5 (1) Clamped Stripline
4 Thermal Coefficient of εr 60 Z ppm/℃ -40C to +150℃ IPC-TM-650 2.5.5.5
5 Volume Resistivity 2.0×107 MΩ·cm COND A IPC-TM-650 2.5.17.1
6 Surface Resistivity 2.0X107 COND A IPC-TM-650 2.5.17.1
7 Electrical Strength 85 Z KV/mm 0.51mm (0.020”) IPC-TM-650 2.5.6.2
8 Coefficient of Thermal Expansion 17 X ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
9 Coefficient of Thermal Expansion 19 Y ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41
10 Coefficient of Thermal Expansion 50 Z ppm/℃ -55 to 260℃ IPC-TM-650 2.4.41

 

PRODUCT

Standard Thickness

Standard Panel Size

Copper Foil

mmWave

0.005”(0.127mm)

0.010”(0.254mm)

 0.020”(0.508mm)

0.030”(0.762mm)

0.060”(1.524mm)

18”×12”(457*305mm)

18”×24”(457*610mm)

36”×48”(915*1220mm)

42”×48”(1067*1220mm)

½ oz. (18μm) HVLP copper foil.

1 oz. (35μm) HVLP copper foil.

2 oz. (70μm) RTF copper foil.

Other claddings may be available. Contact customer service.

PRODUCT CONTACTS

Truman Ma

Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet:  mmWAVE - TDS

Process Guidelines Datasheet:   mmWave-Process-Guide-Lines.pdf

Material Safety Datasheet:  mmWave-Material-Safety-DS.pdf

mmWave77 HIGH FREQUENCY LOW LOSS MATERIALS

mmWave77 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications.

mmWave77 materials exhibits excellent electrical and mechanical properties with a consistent and stable Dielectric Constant and Dissipation Factor over a wide range of frequency (1 GHz to 100 GHz ) and temperature (-40 cº to +120cº). mmWave77 low loss (0.0010 @ 10 GHz values) controlled dielectric materials (+/- 0.05) are available in tightly controlled thickness. These products were developed to provide unique material solutions for current and emerging RF/Microwave design and automotive radar requirements. mmWave77 RF/Microwave low loss controlled dielectric materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption, and copper peel strength.

• Automotive radar applications

• Cellular telecommunications system-power amplifiers and antennas

• Global positioning satellite antennas

• Patch antenna for wireless communications

• Remote meter readers

• Direct broadcast satellites

 

• Stable Dk/Df over Frequency and Temperature

• Low dielectric tolerance +/- 0.05

• Low Moisture Absorption

• Passive Inter-modulation -165 dBc

• Excellent Copper Peel Strength

• UL 94 V-0 Flame Rating

mmWave77


 

   

 

PRODUCT

Standard Thickness

Standard Panel Size

Copper Foil

mmWave77

0.005”(0.127mm)

0.010”(0.254mm)

18”×24”(457*305mm)

21”×24”(457*610mm)

36”×48”(915*1220mm)

42”×48”(1067*1220mm)

 

½ oz. (18μm) HVLP copper foil.

1 oz. (35μm) HVLP copper foil.

 

 

PRODUCT CONTACTS

Truman Ma

Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

Click on the link to download the file

Technical Datasheet: mmWave77 TDS.pdf

Process Guidelines Datasheet:

Material Safety Datasheet:

S7136H
HIGH-FREQUENCY LOW LOSS MATERIALS

S7136H is a hydrocarbon woven glass-reinforced ceramic UL 94 V-0 circuit materials present a strong value proposition for today’s designer where cost, performance and manufacturability are paramount. S7136H materials can be fabricated using standard FR-4 printed circuitry fabrication processes.

The S7136H materials are well suited for use in Hybrid multi-layer printed circuit configurations and are compatible for use in lead free assembly processes.

S7136H materials exhibit excellent electrical and mechanical properties with a consistent and stable dielectric constant and dissipation factor over a wide range of frequencies (1GHz to 20 GHz) and temperatures (-40 ºC to +125 ºC).

S7136H low loss, (0.003 @ 10 GHz values) controlled dielectric materials (+/- 0.05) are available in a broad range of nominal cores and pre-pregs. These products have been developed to provide unique material solutions for current and emerging RF/Microwave design requirements.

S7136H RF/Microwave low loss, controlled dielectric materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption, and copper peel strength.

• Auto Radar

• Base Station Antennas

• Power Amplifiers

• RFID

• Telemetry

• DAS & CPE Antenna

• LNB

 

 • Stable Dk/Df over Frequency and Temperature

• Low dielectric tolerance +/- 0.05

• Low Moisture absorption

• Passive Intermodulation -158 dBc

• Excellent Copper Peel Strength

• UL 94 V-0 Flame Rating

S7136H

wdt_ID PROPERTY Typical Value Direction Units Condition Test Method
1 Dielectric Constant, εr (Process specification) 3.42±0.05 Z 10GHz/23°C IPC-TM-650 2.5.5.5 (1) Clamped Stripline
2 Dielectric Constant, εr (Design specification) 3.61 Z COND A Differential Phase Length Method
3 Dissipation Factor tan, δ 0.003 - 10GHz/23°C IPC-TM-650 2.5.5.5 (1) Clamped Stripline
4 Thermal Coefficient of εr 50 Z ppm/°C -40~+150°C IPC-TM-650 2.5.5.5
5 Volume Resistivity 1.1X108 MΩ·cm COND A IPC-TM-650 2.5.17.1
6 Surface Resistivity 1.6X107 COND A IPC-TM-650 2.5.17.1
7 Electrical Strength 40 Z KV/mm 0.51mm (0.020") IPC-TM-650 2.5.6.2
8 Tensile Modulus 16,120 Y MPa RT ASTM D638
9 Tensile Strength 175 Y MPa RT ASTM D638
10 Flexural Strength 260 X MPa IPC-TM-650 2.4.4

 

 

Standard Thickness Offerings

Standard Panel Sizes

Standard Copper Cladding

  0.010” (0.254mm)

0.020” (0.51mm)

0.030” (0.76mm)

0.060” (1.52mm)

36”X48”, 40” x 48” & 42”x48”

Additional panel sizes may be available

upon request.

1/2 oz. (17 um), 1 oz. (35  um)

electrodeposited copper foil

 

PRODUCT CONTACTS

Truman Ma

Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet:  S7136H- TDS

Process Guidelines Datasheet:  S7136H-Process Guidelines

Material Safety Datasheet:  S7136H MSDS

SCGA-500 GF220
ULTRA LOW LOSS PTFE WOVEN GLASS MATERIALS

SCGA-500 GF220  Ultra Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms that extend into the millimeter range.

SCGA-500 GF220 PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (2.20 Dk +/- 0.02) and Dissipation Factor (0.0009) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).

SCGA-500 GF220  materials exhibit excellent dimensional stability, chemical resistance, low moisture absorption and copper peels strength.

SCGA-500F GF220  Ultra Low Loss Materials are an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.Typical applications include Automotive Radar, Satellite Communications, Filters, Couplers, LNAs, Phased Array Antennas, Power Amplifiers, Avionics and Aerospace.

SCGA-500 GF220 materials are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.

• Automotive Radar

• Satellite Communications

• Filers, Couplers, LNAs

• Phased Array Antennas

• Power Amplifiers

• Avionics and Aerospace

• Consistent and Stable Dk/Df over Frequency and Temperature

• Ultra Low Loss

• Excellent Electrical and Mechanical Properties

• Dimensionally Stable

• Low Moisture Absorption

• Excellent Chemical Resistance

• UL 94 V-0 Flame Rating

• Excellent Price Performance Value

SCGA-500 GF220

SCGA-500 GF220 PROPERTY TEST METHOD UNIT TYPICAL VALUE
1 Dielectric Constant, Dk (@10GHz) IPC-TM650 2.5.5.5 - 2.20±0.02
2 Dissipation Factor, Df (@10GHz) IPC-TM650 2.5.5.5 - 0.0009
3 Passive Inter-Modulation, PIM Summitek 1900b PIM Analyzer dBc -163
4 Thermal Expansion, CTE - X IPC-TM650 2.4.24 PPM/℃ 41
5 Thermal Expansion, CTE - Y IPC-TM650 2.4.24 PPM/℃ 30
6 Thermal Expansion, CTE - Z IPC-TM650 2.4.24 PPM/℃ 217
7 Peel Strength IPC-TM650 2.4.8 N/mm 1.2
8 Water Absorption IPC-TM650 2.6.2.1 % 0.007
9 Density ASTM D-792 g/cm³ 2.18
10 Thermal Conductivity ASTM C518 W/m.K 0.27

Standard THIckness Offerings

Standard Panel Sizes

Standard Copper Cladding

0.010” (0.254mm), 0.020” (0.508mm),

0.030” (0.762mm), 0.060” (1.524mm)

36” x 48” & 40”x48”

Additional sizes may be available upon request

1/2 oz. (17  m), 1 oz. (35   m)

electrodeposited copper foil

 

 

PRODUCT CONTACTS

Truman Ma

Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet:  SCGA-500 GF220 - TDS

Process Guidelines Datasheet:   SCGA-500 Series-Process Guidelines

Material Safety Datasheet:   SCGA-500 GF220 MSDS

SCGA-500 GF255
LOW LOSS PTFE WOVEN GLASS MATERIALS

SCGA-500 GF255 Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms.

SCGA-500 GF255 PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (2.55Dk +/- 0.04) and Dissipation Factor (0.0014) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).

SCGA-500 GF255 RF/Microwave Low Loss controlled dielectric Materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils).

SCGA-500 GF255 Low Loss Materials are an excellent choice for high-volume manufacturing requirements where a balance of cost and performance are of paramount importance.

Typical applications include Base Station Antennas, Power Amplifiers, Satellite Communications, DAS and CPE Antenna, Automotive Radar and Wireless Communications.

SCGA-500 GF255 materials are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.

• Base Station Antennas

• Power Amplifiers

• Satellite Communications

• DAS & CPE Antennas

• Automotive Radar

• Wireless Communications

• Consistent and Stable Dk/Df over Frequency and Temperature

• Extremely Low Loss

• Excellent Electrical and Mechanical Properties

• Dimensionally Stable

• Low Moisture Absorption

• Passive Inter-Modulation -163 dBc

• Excellent Chemical Resistance

• UL 94 V-0 Flame Rating

• Excellent Price Performance Value

SCGA-500 GF265(255)

wdt_ID PROPERTY TEST METHOD UNIT TYPICAL VALUE
1 Dielectric Constant, Dk (@10GHz) IPC-TM650 2.5.5.5 - 2.55±0.04
2 Dissipation Factor, Df (@10GHz) IPC-TM650 2.5.5.5 - 0.0014
3 Passive Inter-Modulation, PIM Summitek 1900b PIM Analyzer dBc -163
4 Thermal Expansion, CTE - X IPC-TM650 2.4.24 PPM/℃ 8.2
5 Thermal Expansion, CTE - Y IPC-TM650 2.4.24 PPM/℃ 7.9
6 Thermal Expansion, CTE - Z IPC-TM650 2.4.24 PPM/℃ 145
7 Peel Strength IPC-TM650 2.4.8 N/mm 1.2
8 Water Absorption IPC-TM650 2.6.2.1 % 0.007
9 Density ASTM D-792 g/cm³ 2.25
10 Thermal Conductivity ASTM C518 W/m.K 0.29

 

Standard THIckness Offerings

Standard Panel Sizes

Standard Copper Cladding

0.010” (0.254mm), 0.020” (0.508mm),

0.030” (0.762mm), 0.060” (1.524mm)

36” x 48” & 40”x48”

Additional sizes may be available upon request

1/2 oz. (17  m), 1 oz. (35   m)

electrodeposited copper foil

PRODUCT CONTACTS

Truman Ma

Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

Click on the link to download the file

Technical Datasheet:  SCGA-500-GF255-TDS.pdf

Process Guidelines Datasheet:  SCGA-500 Series-Process Guidelines

Material Safety Datasheet:  SCGA-500 GF265 MSDS

SCGA-500 GF265
LOW LOSS PTFE WOVEN GLASS MATERIALS

SCGA-500 GF265  Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms.

SCGA-500 GF265 PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (2.65Dk +/- 0.04) and Dissipation Factor (0.0017) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).

SCGA-500 GF265 RF/Microwave Low Loss controlled dielectric Materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils).

SCGA-500F GF265  Low Loss Materials are an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.

Typical applications include Base Station Antennas, Power Amplifiers, Phased Array Antennas, Satellite Communications, Telemetry, Filters, Couplers and LNA’s.

SCGA-500 GF265 materials are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.

• Base Station Antennas

• Power Amplifiers

• Phased Array Antennas

• Satellite Communications

• Telemetry

• Filters, Couplers, LNA’s

• Consistent and Stable Dk/Df over Frequency and Temperature

• Extremely Low Loss

• Excellent Electrical and Mechanical Properties

• Dimensionally Stable

• Low Moisture Absorption

• Passive Inter-Modulation -163 dBc

• Excellent Chemical Resistance

• UL 94 V-0 Flame Rating

• Excellent Price Performance Value

SCGA-500 GF265

wdt_ID PROPERTY TEST METHOD UNIT TYPICAL VALUE
1 Dielectric Constant, Dk (@10GHz) IPC-TM650 2.5.5.5 - 2.65±0.04
2 Dissipation Factor, Df (@10GHz) IPC-TM650 2.5.5.5 - 0.0017
3 Passive Inter-Modulation, PIM Summitek 1900b PIM Analyzer dBc -163
4 Thermal Expansion, CTE - X IPC-TM650 2.4.24 PPM/℃ 9.2
5 Thermal Expansion, CTE - Y IPC-TM650 2.4.24 PPM/℃ 8.8
6 Thermal Expansion, CTE - Z IPC-TM650 2.4.24 PPM/℃ 118
7 Peel Strength IPC-TM650 2.4.8 N/mm 1.2
8 Water Absorption IPC-TM650 2.6.2.1 % 0.007
9 Density ASTM D-792 g/cm³ 2.22
10 Thermal Conductivity ASTM C518 W/m.K 0.28

Standard THIckness Offerings

Standard Panel Sizes

Standard Copper Cladding

0.010” (0.254mm), 0.020” (0.508mm),

0.030” (0.762mm), 0.060” (1.524mm)

36” x 48” & 40”x48”

Additional sizes may be available upon request

1/2 oz. (17  m), 1 oz. (35   m)

electrodeposited copper foil

 

 

PRODUCT CONTACTS

Truman Ma

Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

 Click on the link to download the file

Technical Datasheet:  SCGA-500 GF265 - TDS

Process Guidelines Datasheet:  SCGA-500 Series-Process Guidelines

Material Safety Datasheet:  SCGA-500 GF265 MSDS

SCGA-500 GF300
LOW LOSS PTFE WOVEN GLASS MATERIALS

SCGA-500 GF300  Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms.

SCGA-500 GF300 PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (3.00 Dk +/- 0.04) and Dissipation Factor (0.0023) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).

SCGA-500 GF300 RF/Microwave Low Loss controlled dielectric Materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils).

SCGA-500 GF300  Low Loss Materials are an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.

Typical applications include Base Station Antennas, Power Amplifiers, Antenna Feed Networks, Passive Components, Telemetry, DAS and CPE Antennas.

SCGA-500 GF300 are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.

Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.

• Base Station Antennas

• Power Amplifiers

• Antenna Feed Networks

• Passive Components

• Telemetry

• DAS and CPE Antennas    

• Consistent and Stable Dk/Df over Frequency and Temperature

• Extremely Low Loss

• Excellent Electrical and Mechanical Properties

• Dimensionally Stable

• Low Moisture Absorption

• Passive Inter-Modulation -163 dBc

• Excellent Chemical Resistance

• UL 94 V-0 Flame Rating

• Excellent Price Performance Value

SCGA-500 GF300

wdt_ID PROPERTY TEST METHOD UNIT TYPICAL VALUE
1 Dielectric Constant, Dk (@10GHz) IPC-TM650 2.5.5.5 - 3.00±0.04
2 Dissipation Factor, Df (@10GHz) IPC-TM650 2.5.5.5 - 0.0023
3 Passive Inter-Modulation, PIM Summitek 1900b PIM Analyzer dBc -163
4 Thermal Expansion, CTE - X IPC-TM650 2.4.24 PPM/℃ 6.2
5 Thermal Expansion, CTE - Y IPC-TM650 2.4.24 PPM/℃ 8.6
6 Thermal Expansion, CTE - Z IPC-TM650 2.4.24 PPM/℃ 95
7 Peel Strength IPC-TM650 2.4.8 N/mm 1.2
8 Water Absorption IPC-TM650 2.6.2.1 % 0.01
9 Density ASTM D-792 g/cm³ 2.27
10 Thermal Conductivity ASTM C518 W/m.K 0.28

 

Standard THIckness Offerings

Standard Panel Sizes

Standard Copper Cladding

0.010” (0.254mm), 0.020” (0.508mm),

0.030” (0.762mm), 0.060” (1.524mm)

36” x 48” & 40”x48”

Additional sizes may be available upon request

1/2 oz. (17  m), 1 oz. (35   m)

electrodeposited copper foil

PRODUCT CONTACTS

Truman Ma

Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203

Click on the link to download the file

Technical Datasheet:  SCGA-500 GF300 - TDS

Process Guidelines Datasheet:  SCGA-500 Series-Process Guidelines

Material Safety Datasheet:  SCGA-500 GF300 MSDS