RF AND MICROWAVE
SHENGYI TECHNOLOGY — RF AND MICROWAVE PRODUCTS- AEROWAVE 300
- APPLICATIONS
- FEATURES
- GENERAL PROPERTIES
- PRODUCT SPECIFICATIONS
- PRODUCT CONTACTS
- DOCUMENT DOWNLOADS
AEROWAVE 300
HIGH FREQUENCY LOW LOSS MATERIALS
AeroWave 300 PPE woven glass-reinforced filled UL 94 V-0 circuit materials present a strong value proposition for today’s designer where cost, performance and manufacturability are paramount. AeroWave 300 materials can be fabricated using standard FR-4 printed circuitry fabrication processes. The AeroWave 300 materials well suited for use in hybrid multilayer printed circuit configurations and are compatible for use in lead free assembly processes.
AeroWave 300 materials exhibit excellent electrical and mechanical properties with a consistent and stable dielectric constant and dissipation factor over a wide range of frequencies (1 GHz to 20 GHz ) and temperatures (-40 ºC to +12 ºC).
AeroWave 300 low loss, (Df 0.0031 @ 10 GHz) controlled dielectric materials (Dk 3.0 +/- 0.05) are available in a broad range of nominal cores and pre-pregs. These products have been developed to provide unique material solutions for base station antennas and base station power amplifiers and other current and emerging RF/Microwave design requirements.
AeroWave 300 RF/Microwave low loss, controlled dielectric materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption, and copper peel strength. Passive Inter-modulation (PIM) performance values exceeding -158 dBc are typical (HVLP type of copper foil).
• Stable Dk/Df over frequency and temperature
• Tight Dk tolerance control +/-0.05
• Excellent copper peel strength
• UL 94 V-0 flame rating
• Thermal setting resin system with good PCB processibility and available for hybrid or multilayer design
• Cellular base station antennas
• Antenna feed networks
• Telemetry
• DAS & CPE antenna
• Massive MIMO antenna
AEROWAVE 300
wdt_ID | PROPERTY | Typical Value | Direction | Units | Condition | Test Method |
---|---|---|---|---|---|---|
1 | Dielectric Constant (Process Dk) | 3.0±0.05 | Z | - | 10GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
2 | Dielectric Constant (Design Dk) | 2.98 | Z | - | 1.5 GHz -6GHz/23℃ | Differential Phase Length Method |
3 | Dissipation Factor, Df | 0.0031 | Z | - | 10GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
4 | Thermal Coefficient of Dk | 50 | Z | - | -40~+120℃ | IEC 61189-2-721 (10GHz) |
5 | Tg | 200 | - | ℃ | DMA | IPC-TM-650 2.4.24.4 |
6 | Td | 400 | - | ℃ | TGA | ASTM D3850 |
7 | Coefficient of Thermal Expansion | 15 15 50 | X Y Z | ppm/℃ | TMA | IPC-TM-650 2.4.41 |
8 | Volume Resistivity | 2.21×10^8 | - | MΩ-cm | A | IPC-TM-650 2.5.17.1 |
9 | Surface Resistivity | 6.84×10^7 | - | MΩ | A | IPC-TM-650 2.5.17.1 |
10 | Peel Strength | 0.85 | - | N/mm | after solder float 1 oz. HVLP foil | IPC-TM-650 2.4.8 |
PRODUCT |
Standard Thickness |
Standard Panel Size |
Copper Foil |
AeroWave 300 |
0.005” 0.127mm) 0.010” 0.254mm) 0.020” 0.508mm) 0.030” 0.762mm) 0.060” 1.524mm) |
36”×48”,40”×48”,42”×48”,
|
HVLP type low profile
|
PRODUCT CONTACTS
Click on the link to download the file
Technical Datasheet: AEROWAVE 300-TDS
Process Guidelines Datasheet: AEROWAVE 300-Process-Guide-Lines.pdf
Material Safety Datasheet: AEROWAVE-300-MSDS.pdf
mmWAVE
ULTRA LOW LOSS WOVEN GLASS PPE MATERIAL
mmWave is designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms that extend into the millimeter range. mmWave is a PPE Woven Glass Controlled Dielectric Material with excellent electrical and mechanical properties with a consistent and stable dielectric constant and dissipation factor over a wide range of frequencies and temperatures. mmWave exhibits excellent dimensional stability, chemical resistance and low moisture absorption.
• Automotive Radar
• Base Station Antenna
• GPS Systems
• Point to Point Antenna
• Telemetry
• Avionics & Aerospace
• DAS & CPE Antenna
• mmWave Applications
• Low CTE
• Stable Dk over Frequency and Temperature
• Ultra Low Loss
• Low Moisture Absorption
• Passive Inter-modulation -158 dBc
• Excellent Copper Peel Strength
• UL 94 V-0 Flame Rating
mmWave
wdt_ID | PROPERTY | Typical Value | Direction | Units | Condition | Test Method |
---|---|---|---|---|---|---|
1 | Dielectric Constant, εr (Process specification) | 3.00±0.05 | Z | 10GHz/23℃ | IPC-TM-650 2.5.5.5 (1) Clamped Stripline | |
2 | Dielectric Constant, εr (Design specification) | 3.064 | Z | 6GHz/23℃ | Differential Phase Length Method | |
3 | Dissipation Factor tan, δ | 0.002 | Z | 10GHz/23℃ | IPC-TM-650 2.5.5.5 (1) Clamped Stripline | |
4 | Thermal Coefficient of εr | 60 | Z | ppm/℃ | -40C to +150℃ | IPC-TM-650 2.5.5.5 |
5 | Volume Resistivity | 2.0×107 | MΩ·cm | COND A | IPC-TM-650 2.5.17.1 | |
6 | Surface Resistivity | 2.0X107 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
7 | Electrical Strength | 85 | Z | KV/mm | 0.51mm (0.020”) | IPC-TM-650 2.5.6.2 |
8 | Coefficient of Thermal Expansion | 17 | X | ppm/℃ | -55 to 260℃ | IPC-TM-650 2.4.41 |
9 | Coefficient of Thermal Expansion | 19 | Y | ppm/℃ | -55 to 260℃ | IPC-TM-650 2.4.41 |
10 | Coefficient of Thermal Expansion | 50 | Z | ppm/℃ | -55 to 260℃ | IPC-TM-650 2.4.41 |
PRODUCT |
Standard Thickness |
Standard Panel Size |
Copper Foil |
mmWave |
0.005”(0.127mm) 0.010”(0.254mm) 0.020”(0.508mm) 0.030”(0.762mm) 0.060”(1.524mm) |
18”×12”(457*305mm) 18”×24”(457*610mm) 36”×48”(915*1220mm) 42”×48”(1067*1220mm)
|
½ oz. (18μm) HVLP copper foil. 1 oz. (35μm) HVLP copper foil. 2 oz. (70μm) RTF copper foil. Other claddings may be available. Contact customer service.
|
PRODUCT CONTACTS
Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203
Technical Datasheet: mmWAVE - TDS
Process Guidelines Datasheet: mmWave-Process-Guide-Lines.pdf
Material Safety Datasheet: mmWave-Material-Safety-DS.pdf
- mmWAVE77
- APPLICATIONS
- FEATURES
- GENERAL PROPERTIES
- PRODUCT SPECIFICATIONS
- PRODUCT CONTACT
- DOCUMENT DOWNLOADS
mmWave77 HIGH FREQUENCY LOW LOSS MATERIALS
mmWave77 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications.
mmWave77 materials exhibits excellent electrical and mechanical properties with a consistent and stable Dielectric Constant and Dissipation Factor over a wide range of frequency (1 GHz to 100 GHz ) and temperature (-40 cº to +120cº). mmWave77 low loss (0.0010 @ 10 GHz values) controlled dielectric materials (+/- 0.05) are available in tightly controlled thickness. These products were developed to provide unique material solutions for current and emerging RF/Microwave design and automotive radar requirements. mmWave77 RF/Microwave low loss controlled dielectric materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption, and copper peel strength.
• Automotive radar applications
• Cellular telecommunications system-power amplifiers and antennas
• Global positioning satellite antennas
• Patch antenna for wireless communications
• Remote meter readers
• Direct broadcast satellites
• Stable Dk/Df over Frequency and Temperature
• Low dielectric tolerance +/- 0.05
• Low Moisture Absorption
• Passive Inter-modulation -165 dBc
• Excellent Copper Peel Strength
• UL 94 V-0 Flame Rating
mmWave77
PRODUCT |
Standard Thickness |
Standard Panel Size |
Copper Foil |
mmWave77 |
0.005”(0.127mm) 0.010”(0.254mm) |
18”×24”(457*305mm) 21”×24”(457*610mm) 36”×48”(915*1220mm) 42”×48”(1067*1220mm)
|
½ oz. (18μm) HVLP copper foil. 1 oz. (35μm) HVLP copper foil. |
PRODUCT CONTACTS
Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203
Click on the link to download the file
Technical Datasheet: mmWave77 TDS.pdf
Process Guidelines Datasheet:
Material Safety Datasheet:
S7136H
HIGH-FREQUENCY LOW LOSS MATERIALS
S7136H is a hydrocarbon woven glass-reinforced ceramic UL 94 V-0 circuit materials present a strong value proposition for today’s designer where cost, performance and manufacturability are paramount. S7136H materials can be fabricated using standard FR-4 printed circuitry fabrication processes.
The S7136H materials are well suited for use in Hybrid multi-layer printed circuit configurations and are compatible for use in lead free assembly processes.
S7136H materials exhibit excellent electrical and mechanical properties with a consistent and stable dielectric constant and dissipation factor over a wide range of frequencies (1GHz to 20 GHz) and temperatures (-40 ºC to +125 ºC).
S7136H low loss, (0.003 @ 10 GHz values) controlled dielectric materials (+/- 0.05) are available in a broad range of nominal cores and pre-pregs. These products have been developed to provide unique material solutions for current and emerging RF/Microwave design requirements.
S7136H RF/Microwave low loss, controlled dielectric materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption, and copper peel strength.
• Auto Radar
• Base Station Antennas
• Power Amplifiers
• RFID
• Telemetry
• DAS & CPE Antenna
• LNB
• Low dielectric tolerance +/- 0.05
• Low Moisture absorption
• Passive Intermodulation -158 dBc
• Excellent Copper Peel Strength
• UL 94 V-0 Flame Rating
S7136H
wdt_ID | PROPERTY | Typical Value | Direction | Units | Condition | Test Method |
---|---|---|---|---|---|---|
1 | Dielectric Constant, εr (Process specification) | 3.42±0.05 | Z | 10GHz/23°C | IPC-TM-650 2.5.5.5 (1) Clamped Stripline | |
2 | Dielectric Constant, εr (Design specification) | 3.61 | Z | COND A | Differential Phase Length Method | |
3 | Dissipation Factor tan, δ | 0.003 | - | 10GHz/23°C | IPC-TM-650 2.5.5.5 (1) Clamped Stripline | |
4 | Thermal Coefficient of εr | 50 | Z | ppm/°C | -40~+150°C | IPC-TM-650 2.5.5.5 |
5 | Volume Resistivity | 1.1X108 | MΩ·cm | COND A | IPC-TM-650 2.5.17.1 | |
6 | Surface Resistivity | 1.6X107 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
7 | Electrical Strength | 40 | Z | KV/mm | 0.51mm (0.020") | IPC-TM-650 2.5.6.2 |
8 | Tensile Modulus | 16,120 | Y | MPa | RT | ASTM D638 |
9 | Tensile Strength | 175 | Y | MPa | RT | ASTM D638 |
10 | Flexural Strength | 260 | X | MPa | IPC-TM-650 2.4.4 |
Standard Thickness Offerings |
Standard Panel Sizes |
Standard Copper Cladding |
0.010” (0.254mm) 0.020” (0.51mm) 0.030” (0.76mm) 0.060” (1.52mm) |
36”X48”, 40” x 48” & 42”x48” Additional panel sizes may be available upon request. |
1/2 oz. (17 um), 1 oz. (35 um) electrodeposited copper foil |
PRODUCT CONTACTS
Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203
Technical Datasheet: S7136H- TDS
Process Guidelines Datasheet: S7136H-Process Guidelines
Material Safety Datasheet: S7136H MSDS
- SCGA-500 GF220
- APPLICATIONS
- FEATURES
- GENERAL PROPERTIES
- PRODUCT SPECIFICATIONS
- PRODUCT CONTACT
- DOCUMENT DOWNLOADS
SCGA-500 GF220
ULTRA LOW LOSS PTFE WOVEN GLASS MATERIALS
SCGA-500 GF220 Ultra Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms that extend into the millimeter range.
SCGA-500 GF220 PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (2.20 Dk +/- 0.02) and Dissipation Factor (0.0009) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).
SCGA-500 GF220 materials exhibit excellent dimensional stability, chemical resistance, low moisture absorption and copper peels strength.
SCGA-500F GF220 Ultra Low Loss Materials are an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.Typical applications include Automotive Radar, Satellite Communications, Filters, Couplers, LNAs, Phased Array Antennas, Power Amplifiers, Avionics and Aerospace.
SCGA-500 GF220 materials are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.
Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.
• Automotive Radar
• Satellite Communications
• Filers, Couplers, LNAs
• Phased Array Antennas
• Power Amplifiers
• Avionics and Aerospace
• Consistent and Stable Dk/Df over Frequency and Temperature
• Ultra Low Loss
• Excellent Electrical and Mechanical Properties
• Dimensionally Stable
• Low Moisture Absorption
• Excellent Chemical Resistance
• UL 94 V-0 Flame Rating
• Excellent Price Performance Value
SCGA-500 GF220
SCGA-500 GF220 | PROPERTY | TEST METHOD | UNIT | TYPICAL VALUE |
---|---|---|---|---|
1 | Dielectric Constant, Dk (@10GHz) | IPC-TM650 2.5.5.5 | - | 2.20±0.02 |
2 | Dissipation Factor, Df (@10GHz) | IPC-TM650 2.5.5.5 | - | 0.0009 |
3 | Passive Inter-Modulation, PIM | Summitek 1900b PIM Analyzer | dBc | -163 |
4 | Thermal Expansion, CTE - X | IPC-TM650 2.4.24 | PPM/℃ | 41 |
5 | Thermal Expansion, CTE - Y | IPC-TM650 2.4.24 | PPM/℃ | 30 |
6 | Thermal Expansion, CTE - Z | IPC-TM650 2.4.24 | PPM/℃ | 217 |
7 | Peel Strength | IPC-TM650 2.4.8 | N/mm | 1.2 |
8 | Water Absorption | IPC-TM650 2.6.2.1 | % | 0.007 |
9 | Density | ASTM D-792 | g/cm³ | 2.18 |
10 | Thermal Conductivity | ASTM C518 | W/m.K | 0.27 |
Standard THIckness Offerings |
Standard Panel Sizes |
Standard Copper Cladding |
0.010” (0.254mm), 0.020” (0.508mm), 0.030” (0.762mm), 0.060” (1.524mm) |
36” x 48” & 40”x48” Additional sizes may be available upon request |
1/2 oz. (17 m), 1 oz. (35 m) electrodeposited copper foil |
PRODUCT CONTACTS
Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203
Technical Datasheet: SCGA-500 GF220 - TDS
Process Guidelines Datasheet: SCGA-500 Series-Process Guidelines
- SCGA-500 GF255
- APPLICATIONS
- FEATURES
- GENERAL PROPERTIES
- PRODUCT SPECIFICATIONS
- PRODUCT CONTACT
- DOCUMENT DOWNLOADS
SCGA-500 GF255
LOW LOSS PTFE WOVEN GLASS MATERIALS
SCGA-500 GF255 Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms.
SCGA-500 GF255 PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (2.55Dk +/- 0.04) and Dissipation Factor (0.0014) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).
SCGA-500 GF255 RF/Microwave Low Loss controlled dielectric Materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils).
SCGA-500 GF255 Low Loss Materials are an excellent choice for high-volume manufacturing requirements where a balance of cost and performance are of paramount importance.
Typical applications include Base Station Antennas, Power Amplifiers, Satellite Communications, DAS and CPE Antenna, Automotive Radar and Wireless Communications.
SCGA-500 GF255 materials are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.
Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.
• Base Station Antennas
• Power Amplifiers
• Satellite Communications
• DAS & CPE Antennas
• Automotive Radar
• Wireless Communications
• Consistent and Stable Dk/Df over Frequency and Temperature
• Extremely Low Loss
• Excellent Electrical and Mechanical Properties
• Dimensionally Stable
• Low Moisture Absorption
• Passive Inter-Modulation -163 dBc
• Excellent Chemical Resistance
• UL 94 V-0 Flame Rating
• Excellent Price Performance Value
SCGA-500 GF265(255)
wdt_ID | PROPERTY | TEST METHOD | UNIT | TYPICAL VALUE |
---|---|---|---|---|
1 | Dielectric Constant, Dk (@10GHz) | IPC-TM650 2.5.5.5 | - | 2.55±0.04 |
2 | Dissipation Factor, Df (@10GHz) | IPC-TM650 2.5.5.5 | - | 0.0014 |
3 | Passive Inter-Modulation, PIM | Summitek 1900b PIM Analyzer | dBc | -163 |
4 | Thermal Expansion, CTE - X | IPC-TM650 2.4.24 | PPM/℃ | 8.2 |
5 | Thermal Expansion, CTE - Y | IPC-TM650 2.4.24 | PPM/℃ | 7.9 |
6 | Thermal Expansion, CTE - Z | IPC-TM650 2.4.24 | PPM/℃ | 145 |
7 | Peel Strength | IPC-TM650 2.4.8 | N/mm | 1.2 |
8 | Water Absorption | IPC-TM650 2.6.2.1 | % | 0.007 |
9 | Density | ASTM D-792 | g/cm³ | 2.25 |
10 | Thermal Conductivity | ASTM C518 | W/m.K | 0.29 |
Standard THIckness Offerings |
Standard Panel Sizes |
Standard Copper Cladding |
0.010” (0.254mm), 0.020” (0.508mm), 0.030” (0.762mm), 0.060” (1.524mm) |
36” x 48” & 40”x48” Additional sizes may be available upon request |
1/2 oz. (17 m), 1 oz. (35 m) electrodeposited copper foil |
PRODUCT CONTACTS
Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203
Technical Datasheet: SCGA-500-GF255-TDS.pdf
Process Guidelines Datasheet: SCGA-500 Series-Process Guidelines
Material Safety Datasheet: SCGA-500 GF265 MSDS
- SCGA-500 GF265
- APPLICATIONS
- FEATURES
- GENERAL PROPERTIES
- PRODUCT SPECIFICATIONS
- PRODUCT CONTACT
- DOCUMENT DOWNLOADS
SCGA-500 GF265
LOW LOSS PTFE WOVEN GLASS MATERIALS
SCGA-500 GF265 Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms.
SCGA-500 GF265 PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (2.65Dk +/- 0.04) and Dissipation Factor (0.0017) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).
SCGA-500 GF265 RF/Microwave Low Loss controlled dielectric Materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils).
SCGA-500F GF265 Low Loss Materials are an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.
Typical applications include Base Station Antennas, Power Amplifiers, Phased Array Antennas, Satellite Communications, Telemetry, Filters, Couplers and LNA’s.
SCGA-500 GF265 materials are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.
Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.
• Base Station Antennas
• Power Amplifiers
• Phased Array Antennas
• Satellite Communications
• Telemetry
• Filters, Couplers, LNA’s
• Consistent and Stable Dk/Df over Frequency and Temperature
• Extremely Low Loss
• Excellent Electrical and Mechanical Properties
• Dimensionally Stable
• Low Moisture Absorption
• Passive Inter-Modulation -163 dBc
• Excellent Chemical Resistance
• UL 94 V-0 Flame Rating
• Excellent Price Performance Value
SCGA-500 GF265
wdt_ID | PROPERTY | TEST METHOD | UNIT | TYPICAL VALUE |
---|---|---|---|---|
1 | Dielectric Constant, Dk (@10GHz) | IPC-TM650 2.5.5.5 | - | 2.65±0.04 |
2 | Dissipation Factor, Df (@10GHz) | IPC-TM650 2.5.5.5 | - | 0.0017 |
3 | Passive Inter-Modulation, PIM | Summitek 1900b PIM Analyzer | dBc | -163 |
4 | Thermal Expansion, CTE - X | IPC-TM650 2.4.24 | PPM/℃ | 9.2 |
5 | Thermal Expansion, CTE - Y | IPC-TM650 2.4.24 | PPM/℃ | 8.8 |
6 | Thermal Expansion, CTE - Z | IPC-TM650 2.4.24 | PPM/℃ | 118 |
7 | Peel Strength | IPC-TM650 2.4.8 | N/mm | 1.2 |
8 | Water Absorption | IPC-TM650 2.6.2.1 | % | 0.007 |
9 | Density | ASTM D-792 | g/cm³ | 2.22 |
10 | Thermal Conductivity | ASTM C518 | W/m.K | 0.28 |
Standard THIckness Offerings |
Standard Panel Sizes |
Standard Copper Cladding |
0.010” (0.254mm), 0.020” (0.508mm), 0.030” (0.762mm), 0.060” (1.524mm) |
36” x 48” & 40”x48” Additional sizes may be available upon request |
1/2 oz. (17 m), 1 oz. (35 m) electrodeposited copper foil |
PRODUCT CONTACTS
Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203
Technical Datasheet: SCGA-500 GF265 - TDS
Process Guidelines Datasheet: SCGA-500 Series-Process Guidelines
Material Safety Datasheet: SCGA-500 GF265 MSDS
- SCGA-500 GF300
- APPLICATIONS
- FEATURES
- GENERAL PROPERTIES
- PRODUCT SPECIFICATIONS
- PRODUCT CONTACT
- DOCUMENT DOWNLOADS
SCGA-500 GF300
LOW LOSS PTFE WOVEN GLASS MATERIALS
SCGA-500 GF300 Low Loss PTFE Woven Glass UL 94 V-0 circuit materials have been designed for use in many of today’s demanding and highly challenging RF/Microwave design platforms.
SCGA-500 GF300 PTFE Woven Glass Controlled Dielectric Materials provide excellent electrical and mechanical properties with a consistent and stable Dielectric Constant (3.00 Dk +/- 0.04) and Dissipation Factor (0.0023) over a wide range of frequencies (1 GHz to 20 GHz) and Temperatures (-40 °C to +125 °C).
SCGA-500 GF300 RF/Microwave Low Loss controlled dielectric Materials exhibit exceptional dimensional stability, chemical resistance, low moisture absorption and copper peel strength. Passive Inter-Modulation (PIM) performance values -163 dBc are typical (RTF and VLP type copper foils).
SCGA-500 GF300 Low Loss Materials are an excellent choice for high volume manufacturing requirements where a balance of cost and performance are of paramount importance.
Typical applications include Base Station Antennas, Power Amplifiers, Antenna Feed Networks, Passive Components, Telemetry, DAS and CPE Antennas.
SCGA-500 GF300 are compatible with processes used in the fabrication of standard PTFE Woven Glass materials.
Based in Dongguan since 1985, Shengyi Technology Co., Ltd. (SYTECH) is a world leader in the development and production of laminates. The company maintains a high commitment to on-going R&D efforts and provides a complete portfolio of products ranging from composites to high reliability, thermal management, HSD and RF/PTFE laminate materials.
• Base Station Antennas
• Power Amplifiers
• Antenna Feed Networks
• Passive Components
• Telemetry
• DAS and CPE Antennas
• Consistent and Stable Dk/Df over Frequency and Temperature
• Extremely Low Loss
• Excellent Electrical and Mechanical Properties
• Dimensionally Stable
• Low Moisture Absorption
• Passive Inter-Modulation -163 dBc
• Excellent Chemical Resistance
• UL 94 V-0 Flame Rating
• Excellent Price Performance Value
SCGA-500 GF300
wdt_ID | PROPERTY | TEST METHOD | UNIT | TYPICAL VALUE |
---|---|---|---|---|
1 | Dielectric Constant, Dk (@10GHz) | IPC-TM650 2.5.5.5 | - | 3.00±0.04 |
2 | Dissipation Factor, Df (@10GHz) | IPC-TM650 2.5.5.5 | - | 0.0023 |
3 | Passive Inter-Modulation, PIM | Summitek 1900b PIM Analyzer | dBc | -163 |
4 | Thermal Expansion, CTE - X | IPC-TM650 2.4.24 | PPM/℃ | 6.2 |
5 | Thermal Expansion, CTE - Y | IPC-TM650 2.4.24 | PPM/℃ | 8.6 |
6 | Thermal Expansion, CTE - Z | IPC-TM650 2.4.24 | PPM/℃ | 95 |
7 | Peel Strength | IPC-TM650 2.4.8 | N/mm | 1.2 |
8 | Water Absorption | IPC-TM650 2.6.2.1 | % | 0.01 |
9 | Density | ASTM D-792 | g/cm³ | 2.27 |
10 | Thermal Conductivity | ASTM C518 | W/m.K | 0.28 |
Standard THIckness Offerings |
Standard Panel Sizes |
Standard Copper Cladding |
0.010” (0.254mm), 0.020” (0.508mm), 0.030” (0.762mm), 0.060” (1.524mm) |
36” x 48” & 40”x48” Additional sizes may be available upon request |
1/2 oz. (17 m), 1 oz. (35 m) electrodeposited copper foil |
PRODUCT CONTACTS
Truman Ma
Senior FAE engineer, Marketing
Shengyi Technology Co., Ltd. (China)
Email: majf@syst.com.cn
Mobile: +86 135 0920 1181
Phone: +86 (769) 22271828 ext. 2203
Technical Datasheet: SCGA-500 GF300 - TDS
Process Guidelines Datasheet: SCGA-500 Series-Process Guidelines
Material Safety Datasheet: SCGA-500 GF300 MSDS